IC Substrate Development Engineer

Job Title

IC Substrate Development Engineer

Role Summary

Join Qorvo's RF Packaging Center of Excellence in Greensboro, NC. Develop and qualify next-generation IC substrate and laminate technologies from concept through high-volume manufacturing, working with suppliers and cross-functional design teams.

This is a fully onsite engineering role focused on substrate material development, supplier qualification, and process transfer for RF packaging products.

Experience Level

Entry-level / Early Career — 0–2 years of relevant experience (posting lists "Professional").

Responsibilities

Key responsibilities include technology development, supplier qualification, and cross-functional support throughout product launches.

• Develop technology roadmaps and interface between design teams and global suppliers.
• Develop, qualify, and support launch of new laminate/PCB material sets and suppliers following company processes and documentation standards.
• Design material and surface-finish evaluations using screening tests and DOE to improve RF performance, MSL rating, cost, or size.
• Plan and execute complex process/product development projects using program management methods.
• Troubleshoot and resolve manufacturing and supplier issues; apply structured problem-solving (e.g., DMAIC, 8D).
• Travel to laminate suppliers to support development, qualification, and problem resolution.

Requirements

Required and preferred skills for successful candidates.

Must-have:

• 0–2 years experience in PCB and/or IC substrate manufacturing.
• Practical experience with process development, qualification, and supplier communication.
• Strong communication and collaboration skills.
• Ability to apply structured problem solving and basic program/project management.
• Willingness to travel to supplier sites.
• This position is not eligible for visa sponsorship.

Nice-to-have:

• Familiarity with assembly and packaging processes (SMT, die attach, wire bond/flip chip, molding, multi-layer laminates).
• Experience with laminate/PCB manufacturing processes (Cu pattern plating, panel plating, via drill, surface finishes) and Cu plating/surface finish plating.
• Knowledge of dielectric materials (prepreg, ABF, RCC) and IPC/JEDEC standards.
• Experience with SPC, DOE, DfM, and high-volume manufacturing ramp.
• Project management experience and mSAP laminate fabrication for RF applications.

Education Requirements

Bachelor's degree in Chemistry or an Engineering discipline required.

About the Company

Company: Qorvo

Headquarters: Greensboro, NC, US

Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.