IC Packaging Substrate Engineer (up to Staff)
QualcommJob Title
IC Packaging Substrate Engineer (up to Staff)
Role Summary
Develop, evaluate, and qualify advanced IC substrate and PCB technologies for semiconductor packaging, and drive new product introductions and high-volume manufacturing deployment.
Work within Qualcomm's Packaging Engineering team, collaborating with internal design, electrical, mechanical, materials, and reliability teams and with external substrate/PCB suppliers, OSATs and contract manufacturers.
Experience Level
Senior level (Staff track). Typical expectation: Staff-level candidates have 10+ years in package engineering or related experience; lower seniority within the role may accept fewer years depending on prior responsibilities.
Responsibilities
Primary responsibilities include technology development, qualification, and cross-functional program execution.
- Develop and evaluate next-generation IC substrate and PCB structures, materials, and process flows.
- Establish and manage substrate and PCB design rules and DFM practices with internal design teams.
- Lead new product introduction (NPI) and technical program management for complex process or product developments.
- Work with OSATs, CMs, substrate/PCB suppliers to improve high-volume manufacturing capability and quality; troubleshoot production issues and manage RMA processes.
- Drive supplier development and qualification activities for HVM deployment.
- Collaborate on electrical and thermal performance considerations and reliability qualification.
Requirements
Must-have technical experience and skills; degrees and formal academic requirements are summarized separately below.
- Extensive hands-on experience with IC substrate/PCB manufacturing and process development (FCCSP/PCB) and troubleshooting in a manufacturing environment.
- Experience with substrate material suppliers or semiconductor packaging factories and with PCB manufacturing, preferably including Automotive applications.
- Demonstrated experience in NPI, DFM, and cross-functional program management for packaging technologies.
- Supplier management experience focused on capability improvement, quality control, and problem resolution.
- Knowledge of organic laminate manufacturing, packaging impact on electrical/thermal performance, and component/board-level reliability testing.
- Familiarity with DOE, control plans, FMEA, and statistical process control methods; proficiency in data analysis and material/characterization data interpretation.
- Understanding of reliability test methods and qualification procedures.
- Strong oral and written communication, teamwork, and project management skills.
Education Requirements
Bachelor's degree in Material Science, Chemical, Mechanical, Electrical Engineering or a related field is referenced. Preferred: Master's in Material Science/Chemical/Mechanical/Electrical Engineering. The posting also lists degree-plus-experience alternatives (e.g., Bachelor's +4 years, Master's +3 years, PhD +2 years) and allows equivalent related work experience.
About the Company
Company: Qualcomm
Headquarters: San Diego, California, United States
Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.
