IC Packaging Integration Engineer

Job Title

IC Packaging Integration Engineer

Role Summary

Lead integration and architecture for IC packaging solutions, coordinating silicon, package, systems engineering, and external assembly partners to move designs from concept through qualification to high-volume manufacturing.

Work focuses on package co-design, technology development, and ensuring package solutions meet electrical, mechanical, thermal, reliability, and manufacturability requirements.

Experience Level

Senior — typically requires 10+ years of relevant industry experience.

Responsibilities

Primary responsibilities include leading cross-functional package integration and driving package technology from development to production.

• Lead package co-design with Silicon, Packaging, and Systems teams to meet electrical, mechanical, thermal, reliability, and fit requirements.
• Drive package technology and structure development to improve performance, density, reliability, and cost.
• Collaborate with OSATs/assembly partners through development, NPI, qualification, and high-volume production.
• Create package design documentation, design rules, technical risk assessments, and release checklists for production.
• Define package architecture and layout constraints in support of silicon floorplanning and system integration.
• Support testing, failure analysis, and reliability assessment activities for package solutions.
• Travel as required (approximately 5–10%).

Requirements

Must-have technical skills and experience; preferred skills are listed below.

• Minimum 10+ years of relevant industry experience in semiconductor packaging or related technical roles.
• Proven experience in semiconductor packaging design, process, and technology development.
• Strong understanding of cross-functional packaging areas: floorplan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, materials, component and system-level reliability, testing, and FA.
• Experience working with third-party assembly partners and driving NPI and production transfer.
• Familiarity with package layout tools and workflows (e.g., Cadence APD/Allegro) and BOM/design-for-manufacturing considerations.
• Excellent problem-solving skills with strong fundamentals in physics and engineering; effective written and verbal communication skills for cross-functional collaboration.
• Ability to work independently and drive projects with minimal supervision.
• Nice-to-have: background in advanced SiP/advanced packaging technologies and high-density interconnect solutions.

Education Requirements

Minimum: Bachelor's degree (BS) is specified alongside 10+ years of industry experience. Preferred: Master's or PhD. Relevant fields referenced or implied include semiconductor/packaging engineering, electrical engineering, materials science, mechanical engineering, physics, or related technical disciplines.

About the Company

Company: Apple

Headquarters: Cupertino, California, United States

Apple is a multinational technology company that designs, manufactures, and sells consumer electronics, software, and online services. Known for its innovative products such as the iPhone, Mac computers, and iPad, Apple emphasizes a strong commitment to high-quality design and user experience.