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IC Packaging Engineer

Apple
September 02, 2026
Full-time
On-site
Cupertino, California, United States
$150,400 - $225,300 USD yearly
Other Semiconductor Jobs, Level - Mid-Career

Job Title

IC Packaging Engineer

Role Summary

Design and validate thermal solutions for integrated circuits and semiconductor packages to meet performance and energy-efficiency targets. Collaborate with silicon designers, system thermal teams, and cross-functional stakeholders to develop modeling, simulation, and test-based solutions for mobile and high-power platforms.

Experience Level

Mid-level role. The posting indicates approximately 4 years of related experience is expected.

Responsibilities

Core responsibilities include modeling, analysis, cross-team debugging, and optimization of IC/package thermal performance.

  • Architect thermal solutions addressing chip energy efficiency and performance scaling.
  • Run CFD and heat-transfer simulations; develop reduced-order and detailed thermal models.
  • Provide thermal modeling at die and package levels and advise on packaging/floor-planning trade-offs.
  • Work cross-functionally with silicon design and system thermal teams to diagnose and resolve thermal issues.
  • Analyze simulation and measurement data to improve product thermal management.

Requirements

Must-have technical skills and experience.

  • Proficiency applying heat transfer principles and analytical methods to packaging and system-level thermal design.
  • Experience implementing conductive heat-transfer models and automating simulation workflows using C++ or Python.
  • Experience using CFD tools to analyze flow and heat transfer for air- or liquid-cooled systems.
  • Experience designing advanced cooling solutions and optimizing packaging architecture for sustained power and thermal efficiency.
  • Experience with CAD tools for design, prototyping, and manufacturing of thermal hardware.
  • Familiarity with two-phase heat transfer and cold-plate design for high-power applications.
  • Experience designing and running thermal characterization tests to validate thermal response under realistic conditions.
  • Knowledge of fluid dynamics to optimize pressure drop, flow distribution, and coolant flow rates.

Education Requirements

Master's degree (or foreign equivalent) in Mechanical Engineering or a related field is required. The posting pairs this with approximately 4 years of relevant experience in the job offered or a related occupation.


About the Company

Company: Apple

Headquarters: Cupertino, California, United States

Apple is a multinational technology company that designs, manufactures, and sells consumer electronics, software, and online services. Known for its innovative products such as the iPhone, Mac computers, and iPad, Apple emphasizes a strong commitment to high-quality design and user experience.

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Date Posted: 2026-09-02