IC Packaging Design Engineer, Amazon Leo

Job Title

IC Packaging Design Engineer, Amazon Leo

Role Summary

Join the Amazon Leo team to develop IC packaging and package-to-board solutions for beamforming RF chips used in Low Earth Orbit satellites. The role interfaces with RF and digital chip designers, package vendors, thermal and antenna teams to take packages from concept through qualification and volume production.

Experience Level

Mid-level - requires at least 5+ years of relevant experience in RF/packaging engineering; 7+ years preferred for full-custom package and PCB design responsibilities.

Responsibilities

Work across chip, package, PCB, and test teams to design and validate IC packages for RF beamforming chips.

• Define floorplans, bump/ball maps, and package layouts in collaboration with digital and RF chip designers.
• Work with package vendors on stack-ups, material selection, package options, and thermal testing/design.
• Analyze cost vs. performance trade-offs and complete layouts for package types (FCBGA, FCCSP, WLCSP, QFN, etc.).
• Set up and run 3D electromagnetic simulations of package+PCB (e.g., HFSS, Momentum) to verify designs.
• Perform signal integrity analysis and create package models to identify crosstalk and coupling issues.
• Support thermal simulations and collaborate with thermal engineering for package and PCB thermal behavior.
• Collaborate with Antenna and EE teams to design and layout test and application PCBs for packages.
• Advise on package qualification and reliability testing (HAST, HTOL, board-level reliability).
• Define and implement automation and AI-driven workflows to improve packaging design productivity.

Requirements

Core technical requirements and proven experience relevant to RF packaging and high-volume production.

Must-have

• 5+ years experience in RF design and packaging engineering, preferably with advanced node ICs.
• Proven track record of products that reached volume production.
• Experience with RF communication systems and RF fundamentals (S-parameters, impedance matching, passive components).
• Strong understanding of power integrity and selection/optimization of passives in packages.
• Experience routing high-speed, high-pin-count digital and analog interfaces (e.g., SERDES, CPU, memory).
• Familiarity with package materials and reliability considerations for high-volume manufacturing.

Nice-to-have

• Experience with HFSS, Momentum, or similar 3D EM simulation tools.
• 7+ years designing full-custom packages/PCBs for high-performance chips.

Education Requirements

Bachelor's degree in Electrical Engineering or a related field is listed as required. A Master’s degree in Electrical or Communications Engineering (or related) is preferred. The posting allows related technical fields; no certifications were specified.

About the Company

Company: Amazon

Headquarters: Seattle, Washington, United States

Amazon is a global leader in e-commerce and cloud computing, committed to delivering fast, reliable services across diverse sectors. The company's innovative technologies include AWS, Kindle, and Echo, as well as developing low Earth orbit satellite networks for improved internet connectivity worldwide.