IC Package Thermal Mechanical Engineer

Job Title

IC Package Thermal Mechanical Engineer

Role Summary

Design and validate mechanical and thermo-mechanical aspects of advanced semiconductor packages for HPC, AI, and networking products. The role combines advanced multiphysics simulation (majority of time) with hands-on reliability lab testing during product definition and New Product Introduction (NPI).

Experience Level

Senior. Posting specifies experience guidance by degree: Bachelor's +8 years, Master's +6 years, or PhD +3 years.

Responsibilities

Work across simulation, testing, and NPI to ensure package reliability and manufacturability.

• Develop, run, and validate advanced FEA and multiphysics models for stress, strain, deformation, warpage, thermal cycling, and delamination (approx. 70% simulation).
• Apply structural mechanics, fluid, and heat-transfer principles to chip-package and package-board interaction problems.
• Automate simulation workflows, model generation, post-processing, DOE, and reliability-data analysis using scripting and tool integration.
• Incorporate ML/Gen-AI and numerical tools to build automated interfaces and accelerate analysis.
• Lead and perform hands-on reliability lab testing (e.g., electromigration, temperature cycling, drop tests) and use experimental data to inform models (approx. 30% lab work).
• Collaborate with failure analysis, materials, and manufacturing teams to diagnose failures and improve yield.

Requirements

Key must-have skills and preferred competencies.

• Must-have: Hands-on proficiency with FEA tools, specifically ANSYS (Classic/Mechanical).
• Must-have: Strong scripting and programming in Ansys APDL, Python, and/or MATLAB for model automation and data analysis.
• Must-have: Deep knowledge of electronic packaging structures, advanced materials, and ability to evaluate simulations against first-principles solid-mechanics solutions.
• Must-have: Practical experience with reliability testing and interpreting test data for package failure mechanisms (electromigration familiarity required).
• Preferred: Experience developing accelerated electromigration tests for package-level interconnects and working with failure-analysis teams.
• Preferred: Hands-on material characterization experience (DMA/TMA, nano-indentation) and thermal-analysis tools such as Icepak or Flotherm.
• Preferred: Experience integrating Machine Learning or generative AI into engineering workflows.

Education Requirements

Degree and experience guidance: Bachelor's degree with 8+ years of relevant industry experience; OR Master's degree with 6+ years; OR PhD with 3+ years in Mechanical Engineering, Materials Science, or a related technical field with emphasis on solid mechanics.

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.