IC Package Mechanical FEA Engineer

Job Title

IC Package Mechanical FEA Engineer

Role Summary

The IC Package Mechanical FEA Engineer will design, model, and validate thermo-mechanical packaging solutions for high-speed photonic ASICs. The role focuses on FEA-driven reliability, warpage, stress, and thermal performance for flip-chip, MCM, and 3D integration architectures within an R&D organization.

You will work closely with design, photonics, manufacturing, and reliability teams to influence ASIC mechanical design and ensure scalable, manufacturable package architectures.

Experience Level

Senior — typical experience guidance: PhD with 7+ years FEA experience, Master's with 10+ years, or Bachelor's with 12+ years.

Responsibilities

Primary responsibilities include simulation, analysis, experiment-driven validation, and cross-functional collaboration.

• Perform FEA simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across flip-chip, fan-out, 2.5D/3D IC, chiplet-based, and TSV-enabled architectures.
• Define simulation requirements, analyze results, and deliver actionable design and process recommendations.
• Lead design-of-experiments (DOE) and sensitivity analyses to identify key reliability and performance drivers.
• Develop and execute lab-level mechanical tests and metrology to validate and calibrate simulation models.
• Assess new materials, interconnect structures, and process flows from a thermo-mechanical reliability perspective.
• Collaborate with cross-functional teams and external vendors to ensure robust, scalable package architectures.

Requirements

Must-have technical skills and experience:

• Deep expertise in advanced packaging technologies: flip-chip, FOWLP, 2.5D/3D integration, chiplet architectures, and TSVs.
• Strong understanding of materials behavior for polymers, metals, and ceramics and their thermo-mechanical interactions.
• Familiarity with semiconductor packaging processes such as die attach, underfill, molding, bumping, and reflow.
• Proficiency with FEA tools, including Ansys Classic/Mechanical and Abaqus.
• Ability to interpret and correlate complex simulation results using first-principles mechanical engineering concepts.
• Demonstrated experience calibrating models with empirical data and performing mechanical testing and metrology.
• Proven capability to develop and run lab experiments to validate simulations and identify root causes.
• Strong judgment balancing manufacturing constraints, reliability requirements, cost, and performance.
• Excellent self-management, presentation, documentation, and cross-functional communication skills.

Education Requirements

Bachelor's degree in Mechanical Engineering or a related field with 12+ years of FEA experience; Master's degree with 10+ years; PhD with 7+ years. Fields referenced: Mechanical Engineering or related technical disciplines. No specific certifications were listed.

About the Company

Company: Lumilens

Headquarters: San Jose, CA, USA

Lumilens develops integrated photonics and optical interconnect solutions for high-speed data communication and chip-to-chip interfaces, focusing on optical front-end hardware and co-packaged optics for advanced semiconductor systems.