IC Package Design Engineer

Job Title

IC Package Design Engineer

Role Summary

Support planning, coordination, and execution of IC package design activities across semiconductor product programs, from early feasibility and design planning through tapeout and manufacturing readiness.

Main mission is program execution and delivery predictability through cross-functional coordination with package design, integration, SI/PI, manufacturing, suppliers, and tooling teams.

Experience Level

Entry-level — typical requirement is 1–3 years of relevant experience depending on degree (see Education Requirements).

Responsibilities

Primary focus on program execution, cross-functional coordination, and process enablement. Key responsibilities include:

• Support execution of IC package design programs from early planning through tapeout and post‑tapeout support.
• Develop and maintain execution plans, schedules, milestone trackers, and task lists.
• Track risks, issues, dependencies, and action items; drive follow‑up, escalation, and closure with clear ownership.
• Prepare and deliver status updates, dashboards, execution summaries, and readiness reports to stakeholders.
• Coordinate inputs for design reviews and execution checkpoints; capture outcomes and follow‑ups.
• Coordinate across Package Design, Integration, SI/PI, Process, Substrate, NPI, Operations, and external suppliers/OSATs to resolve blockers and align schedules.
• Ensure EDA/design‑flow/tool readiness and assist with tooling triage when needed.
• Document and maintain process flows, release/handoff steps, readiness checks, and escalation paths; capture lessons learned.
• Apply light scripting/automation for reporting, consistency checks, or process enforcement where useful.

Requirements

Must-have skills and technical background (degree requirements summarized under Education Requirements):

• Experience supporting complex, cross‑functional engineering programs and managing multiple parallel workstreams.
• Strong organizational skills and ability to drive execution in a matrixed organization without direct authority.
• Proven written and verbal communication skills for status reporting and stakeholder alignment.
• Experience with program/project management tools: dashboards, milestone/dependency trackers, Gantt charts, and action‑item/risk tracking.
• Familiarity with IC package development lifecycles, package design/layout/integration, and manufacturing concepts.
• Exposure to package design and EDA tools such as Cadence APD/SIP, Innovus, Virtuoso, Mentor Xpedition, Valor, or RAVEL.
• Scripting or automation experience (Python, TCL) is a plus.

Education Requirements

Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related technical field plus 2+ years of system/package design or technology engineering experience; OR Master's in those fields plus 1+ year of relevant experience; OR PhD in those fields. Related technical degrees or equivalent practical experience are considered.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.