Job Title
IC Design Engineer
Role Summary
Work on block- and full-chip power and signal integrity sign-off, power estimation, and PDN/EM analysis for SoC designs. Collaborate with SoC and packaging teams on bump assignment and package routing to ensure power and signal integrity across die, interposer, package, and board.
Experience Level
Mid-level. Years of experience not specified.
Responsibilities
Primary responsibilities include sign-off, analysis, and implementation of power and signal integrity at block and chip level.
- Block- and full-chip static (IR) and dynamic (IVD) sign-off.
- Power estimation for blocks and full chip (vector and vectorless methods).
- Signal and power EM sign-off at block and full-chip level.
- Design and implement custom power grids for blocks and hard macros.
- Power-delivery-network (PDN) system-level analysis considering die, interposer, package, and board.
- Collaborate with SoC and packaging teams on bump assignment and package routing optimization.
- Dynamic analysis using vectorless, vector, and mixed-mode approaches.
- Power-grid resistance checks.
Requirements
Key technical requirements and expectations.
Must-have
- Practical experience with block- and chip-level IR/IVD sign-off and power estimation.
- Experience in signal/power EM analysis and PDN/system-level analysis.
- Experience implementing power grids and analyzing power-grid resistance.
- Experience collaborating with packaging/SoC teams on bump assignment and package routing.
Nice-to-have
- Familiarity with mixed-mode dynamic analysis and vectorless methodologies.
- Experience with hard macros and custom power-grid solutions.
Education Requirements
Not specified.
About the Company
Company: Broadcom
Headquarters: Irvine, California, United States
Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.

Date Posted: 2026-07-23