High-Speed Mixed-Signal Design Engineer

Job Title

High-Speed Mixed-Signal Design Engineer

Role Summary

Design and validate high-speed electronic systems that interface with photonic integrated circuits, including modulator drivers, trans-impedance amplifiers, SerDes front-ends, and associated analog signal chains. Work from transistor-level circuit design through package and board-level integration to meet bandwidth, linearity, noise, and power targets for electro-optic links.

Experience Level

Mid-level — typically requires 3+ years of experience in high-speed analog, mixed-signal, or RF circuit design with emphasis on multi-GHz bandwidths.

Responsibilities

Key responsibilities include:

• Design and analyze high-speed analog and mixed-signal circuits (modulator drivers, TIAs, CTLEs, limiting amplifiers, CDRs).
• Develop circuit-level and system-level models including device parasitics, package effects, and photonic component behavior.
• Perform transistor-level simulation and verification across process corners, temperature, and supply variation using tools such as Cadence Virtuoso/Spectre, ADS, HFSS.
• Architect high-speed electrical interfaces between electronic ICs and photonic ICs: impedance matching, bandwidth targets, voltage swing, and power constraints.
• Lead or contribute to chip-to-package-to-board co-design, high-speed interconnect design, and SI/PI analysis.
• Define characterization and validation strategies (S-parameters, eye diagrams, BER testing) and correlate measurement data to simulation.
• Partner with manufacturing and test engineering to develop production test methods for high-speed assemblies.
• Contribute to component selection, evaluation, and qualification for high-speed electronic devices.

Requirements

Must-have qualifications:

• 3+ years of experience in high-speed analog, mixed-signal, or RF circuit design with multi-GHz bandwidth emphasis.
• Strong foundation in analog and RF circuit design principles (small-signal and large-signal analysis, noise analysis, stability).
• Experience with circuit simulation tools (Cadence Spectre, ADS, HFSS, or equivalent).
• Understanding of high-speed serial link architectures and signaling formats (NRZ, PAM4, coherent modulation).
• Hands-on lab characterization experience with high-bandwidth oscilloscopes, VNAs, BERTs, and spectrum analyzers.
• Working knowledge of semiconductor device physics and IC fabrication processes (CMOS, SiGe BiCMOS, or III-V).
• Programming and data analysis skills (Python, MATLAB) for simulation automation and data processing.
• Willingness to work extended hours and weekends as needed.

Nice-to-have:

• Experience designing high-speed circuits for optical communications (modulator drivers, TIAs, SerDes front-ends).
• ASIC/custom IC design experience from specification through tapeout and silicon validation.
• Experience with high-speed packaging and interconnect design (wirebond, flip-chip, co-packaged optics) and EM simulation tools.
• Familiarity with DSP equalization (FFE, DFE, CTLE), PLL/CDR design, and photonic-electronic co-design tools.
• Experience with silicon photonics or III-V electro-optic platforms and reliability/qualification testing.

Education Requirements

Master's or PhD in Electrical Engineering, Applied Physics, or a related discipline (the posting specifies Master's or PhD). No certifications or equivalent-experience language was specified.

About the Company

Company: Mesh Optical Technologies

Headquarters: Gardena, CA, United States

Developer of integrated optical hardware and electro-optic systems, focusing on high-speed photonic-electronic platforms and scalable optical links. The company designs modulators, trans-impedance amplifiers, SerDes interfaces, and supporting mixed-signal electronics for multi-GHz optical communications and co-packaged optics integration.