HBM SoC RTL Design Engineer

Job Title

HBM SoC RTL Design Engineer

Role Summary

As a SoC Design Engineer in the Heterogeneous Integration Group (HIG), you will design, develop, and integrate RTL for next-generation HBM logic-die SoC blocks and subsystems. Collaborate with architecture, verification, physical design, firmware, and product teams to deliver high-performance, manufacturable SoC solutions and integrate AI-assisted tools into the design flow.

Experience Level

Mid-level — the posting specifies a minimum of 3 years of relevant experience.

Responsibilities

Primary responsibilities include:

• Design and implement RTL for SoC-level blocks and subsystems used in HBM logic die.
• Integrate internal and third-party IP (controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY-adjacent logic).
• Translate architectural and micro-architectural specifications into high-quality RTL implementations with SoC architects.
• Participate in SoC-level integration: clocking, reset, power intent, and configuration infrastructure.
• Support pre-silicon validation and post-silicon bring-up, including root-cause analysis of silicon issues.
• Produce design documentation, block specifications, and participate in design reviews.
• Collaborate with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure manufacturable builds.

Requirements

Must-have:

• Proficiency in SystemVerilog/Verilog and familiarity with SoC integration methodologies.
• Experience with the RTL-to-GDS flow, including synthesis, static timing analysis, and sign-off considerations.
• Familiarity with EDA tools from Cadence, Synopsys, and/or Siemens.
• Programming or scripting experience (Python, TCL, Perl, or shell scripting).

Nice-to-have:

• Experience with HBM, DRAM, or memory-centric SoC designs.
• Familiarity with high-speed interfaces, clocking strategies, reset architectures, and power management concepts.
• Exposure to DFT concepts (scan, MBIST, BIRA/BISR) and debug.
• Experience with hardware emulation/acceleration platforms (Palladium, Veloce, Zebu).
• Understanding of or willingness to learn Agentic AI to improve design workflows.

Education Requirements

Bachelor's or Master’s degree in Electrical Engineering, Computer Engineering, or a related field. The posting specifies a minimum of 3 years of relevant experience.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.