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HBM SoC RTL Design Engineer

Micron Technology
November 2, 2026
Full-time
On-site
Folsom, California, United States
$181,000 - $323,000 USD yearly
RTL Design Jobs, Level - Senior

Job Title

HBM SoC RTL Design Engineer

Role Summary

Join the Heterogeneous Integration Group (HIG) to design, develop, and integrate HBM SoC logic die. The role requires hands-on RTL implementation, IP integration, debugging, and pre-/post-silicon support across cross-functional teams including architecture, verification, physical design, firmware, and product.

Experience Level

Senior - requires a minimum of 10 years of relevant experience in SoC/ASIC RTL or related design fields.

Responsibilities

Primary responsibilities focus on RTL design, IP integration, and silicon bring-up for HBM-centric SoC logic die.

  • Design and implement RTL for SoC-level blocks and subsystems used in HBM logic die.
  • Integrate internal and third-party IP (controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY-adjacent logic).
  • Translate architectural and micro-architectural specifications into RTL in collaboration with SoC architects.
  • Participate in SoC integration activities: clocking, reset, power intent, and configuration infrastructure.
  • Support pre-silicon validation and post-silicon bring-up, including root-cause analysis of silicon issues.
  • Produce design documentation, block specifications, and participate in design reviews.
  • Collaborate with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure manufacturable designs.

Requirements

Must-have technical skills and tools to perform the role; preferred items listed separately.

Must-have:

  • Proficiency in SystemVerilog/Verilog and SoC integration methodologies.
  • Experience with RTL-to-GDS flow, including synthesis, static timing analysis, and sign-off considerations.
  • Familiarity with EDA tools from Cadence, Synopsys, and/or Siemens.
  • Programming/scripting experience (Python, TCL, Perl, or shell scripting).

Nice-to-have:

  • Experience with HBM, DRAM, or memory-centric SoC designs.
  • Familiarity with high-speed interfaces, clocking strategies, reset architectures, and power management.
  • Exposure to DFT concepts (scan, MBIST, BIRA/BISR) and debug methodologies.
  • Experience with hardware emulation or acceleration platforms (e.g., Palladium, Veloce, Zebu).

Education Requirements

Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related technical field.


About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

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Date Posted: 2026-10-30