HBM SIPI, Senior Engineer

Job Title

HBM SIPI, Senior Engineer

Role Summary

Senior SI/PI engineer within the Heterogeneous Integration Group focused on HBM build architecture. Develop and validate signal integrity, power integrity, and electromagnetic models for interposers, packages, and silicon channels to support HBM product sign-off across multiple generations.

Work spans channel analysis, PDN architecture, timing closure, and automation efforts to maintain industry-leading signal quality and power delivery for high-speed memory interfaces used in AI/ML systems.

Experience Level

Senior-level. Minimum 3 years of relevant SI/PI experience; 5+ years preferred.

Responsibilities

Deliver SI/PI analysis, modeling, and automation for interposer, package, and silicon channels. Key responsibilities include:

• Perform signal integrity channel analysis for 2.5D/3D interposers: frequency-domain (insertion loss, return loss, PSXT, IL-to-XT) and time-domain (eye, BER, jitter decomposition).
• Conduct mask-based timing analysis using time-domain simulations (e.g., SPICE, ADS).
• Support power integrity and PDN analysis, including impedance modeling and transient response analysis.
• Perform electromagnetic extraction and modeling for PCB, package, interposer signal and power channels.
• Automate sign-off processes and collaborate with EDA suppliers to improve tool accuracy and analysis flow.

Requirements

Must-have:

• At least 3 years of experience in signal integrity (SI) and power integrity (PI) modeling and analysis.
• Strong understanding of SI/PI, electromagnetic and transmission line theory, and I/O design.
• Experience with circuit simulation tools such as Keysight ADS and Synopsys HFSS.
• Experience using AI/ML/LLM to improve engineering productivity or efficiency.

Nice-to-have:

• 5+ years of SI/PI and PDN modeling experience, particularly for 2.5D/3D advanced packaging (CoWoS, EMIB, interposer designs).
• Experience with mask-based timing and jitter analysis using time-domain simulation (SPICE, ADS).
• Experience with high-speed interfaces such as DDR, HBM, UCIe, PCIe, and SERDES.
• Proficiency with EDA tools including ANSYS HFSS/SIwave, Keysight ADS, Synopsys HSPICE, and Cadence PowerSI/PowerDC.

Education Requirements

Not specified.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.