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HBM SI/PI Principal Engineer

Micron Technology
September 16, 2026
Full-time
On-site
Richardson, Texas, United States
Other Semiconductor Jobs, Level - Senior

Job Title

HBM SI/PI Principal Engineer

Role Summary

Senior technical authority for signal integrity (SI) and power integrity (PI) in High Bandwidth Memory (HBM) systems within the Heterogeneous Integration Group. The role drives system-level SI/PI architecture, analysis methodologies, and sign-off criteria across 2.5D and 3D interposer-based designs.

This position supports design and deployment of HBM-enabled platforms for AI/ML applications and requires end-to-end ownership from modeling through production sign-off.

Experience Level

Senior - minimum 7 years of relevant SI/PI modeling and analysis experience; 10+ years preferred.

Responsibilities

Accountable for SI/PI technical leadership across package, interposer, and PCB domains.

  • Lead signal integrity channel analysis for 2.5D and 3D interposers using frequency- and time-domain methods.
  • Define and drive power delivery architecture, impedance targets, and transient PDN analysis.
  • Perform electromagnetic extraction and modeling across PCB, package, and interposer stacks.
  • Establish SI/PI standards, methodologies, and sign-off criteria for HBM system designs.
  • Provide clear technical direction and decisions in ambiguous or incomplete design environments.
  • Influence cross-team architecture and ensure designs meet performance, reliability, and scalability targets.

Requirements

Must-have technical skills and experience required for independent ownership of SI/PI for HBM systems.

  • Must-have: 7+ years of experience in signal integrity and power integrity modeling and analysis.
  • Must-have: Strong fundamentals in electromagnetics, transmission line theory, and I/O design.
  • Must-have: Hands-on experience with industry SI/PI EDA tools (examples: ANSYS, Synopsys, Cadence, Keysight).
  • Nice-to-have: 10+ years of SI and PDN modeling and analysis experience.
  • Nice-to-have: Experience with 2.5D/3D advanced packaging and interposer-based designs.
  • Nice-to-have: Background with high-bandwidth interfaces such as HBM, DDR, SERDES, or UCIe.
  • Nice-to-have: Direct ownership of system-level SI/PI sign-off for production silicon.
  • Nice-to-have: Scripting experience to automate SI/PI flows (TCL and/or Python).

Education Requirements

Not specified.


About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

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Date Posted: 2026-09-15