HBM Product Engineer
Design, analyze, and validate test structures and layouts for High Bandwidth Memory (HBM) products with emphasis on thermal, electrical, and mechanical reliability. Collaborate with design, process, and package engineering teams to support product qualification, yield improvement, and chip-package co-design.
This role contributes to ensuring manufacturability and reliability of advanced memory products.
Mid-level. Years of experience not specified.
Primary responsibilities include:
Must-have technical skills and tools:
Employer will accept a Ph.D. in Electrical and Computer Engineering, Thermal and Semiconductor Processing, or a related field. No other degrees or equivalent-experience language specified.
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
