HBI Module Development Engineer

Job Title

HBI Module Development Engineer

Role Summary

Senior engineer responsible for developing and transferring die-to-wafer hybrid bonding (HBI) processes and equipment to improve module performance, yield, reliability, and manufacturability. Work includes first-of-a-kind platform development and optimization for high-volume manufacturing in partnership with integration, manufacturing, and external suppliers.

Experience Level

Senior. Typical experience aligns with the posted minimums: at least 5+ years in hybrid bonding/wafer bonding/advanced packaging; overall industry experience requirements vary by degree (see Education Requirements).

Responsibilities

Primary responsibilities include process and equipment development, characterization, and transfer to manufacturing.

• Drive process and equipment development for die-to-wafer hybrid bonding: parameter optimization, equipment characterization, and process control.
• Develop and optimize manufacturing processes to improve yield, reliability, defectivity, and throughput.
• Improve bond interface quality, alignment and overlay accuracy, surface preparation, and contamination control.
• Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies.
• Lead first-of-a-kind (FOK) process and equipment capability development and support technology transfer to manufacturing.
• Conduct feasibility studies using characterization, modeling, simulation, and experimental methods.
• Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions.
• Collaborate across technology development, process integration, and manufacturing teams; mentor and develop engineers.

Requirements

Must-have technical skills and industry experience; preferred qualifications listed separately.

• Deep technical experience in hybrid bonding, wafer bonding, or advanced packaging process or equipment engineering.
• Minimum 5+ years of industry experience specific to hybrid bonding/wafer bonding/advanced packaging.
• Experience with process characterization, metrology, defect inspection, or failure analysis techniques.
• Proficiency in DOE design and statistical analysis for process optimization.
• Demonstrated ability to lead FOK development, improve equipment capability, and scale processes for manufacturing.
• Strong written and verbal communication; ability to influence cross-functional teams and mentor junior engineers.

Nice-to-have:

• Experience introducing new hybrid bonding platforms or advanced packaging technologies.
• Knowledge of bond interface defect mechanisms (void formation, adhesion challenges, contamination effects).
• Experience improving equipment throughput, utilization, or process performance in a manufacturing environment.
• Experience collaborating with external equipment suppliers and materials vendors on technology development.

Education Requirements

Bachelor's, Master's, or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field. The posting specifies degree-plus-experience minimums (B.S. +9 years, M.S. +6 years, Ph.D. +5 years) and notes qualifications may be obtained through a combination of industry experience, internships, coursework, or research.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.