Hardware - Thermal Engineer

Job Title

Hardware Thermal Engineer

Role Summary

Design and validate thermal solutions for AI accelerator hardware across package, PCB, card, and system levels. Work with electrical, mechanical, manufacturing, and customer teams to integrate cooling solutions into production hardware and ensure thermal compliance with target form factors.

Primary responsibilities include CFD-based thermal modeling, empirical thermal validation, reliability testing support, and producing thermal design documentation and specifications.

Experience Level

Mid-level. The posting does not specify required years of experience.

Responsibilities

Deliver end-to-end thermal design, simulation, testing, and documentation for NPU/ASIC cards and systems.

• Define thermal architecture across package → PCB → card (PCIe FHFL/HHHL, OAM, SXM) → system (server chassis).
• Select and design heatsinks, heat pipes, vapor chambers, cold plates, and thermal interface materials (TIM).
• Perform CFD simulations (FloTHERM, Icepak) and EM-thermal co-simulation using power maps from HFSS / SIwave / PowerDC.
• Validate thermal performance via wind tunnel testing, thermocouples, IR/FLIR imaging, RTDs, and DOE-based correlation of simulation to measurement.
• Support reliability testing including thermal cycling and burn-in.
• Integrate thermal solutions with electrical, mechanical, and manufacturing constraints and negotiate thermal specs with OEM/ODM and hyperscale customers.
• Create thermal design guides, reference designs, and test reports; ensure compliance with form-factor standards (OCP OAM, PCIe CEM, NVIDIA SXM, etc.).

Requirements

Must-have technical skills and experience are listed first; preferred items follow.

• Must-have: Experience with CFD thermal modeling and simulation for electronics (FloTHERM, Icepak or equivalent).
• Must-have: Practical design experience with active and passive cooling solutions (heatsinks, fans, liquid coldplates, heat pipes, vapor chambers, TIM).
• Must-have: Hands-on thermal testing experience for accelerator cards (thermocouples, FLIR/IR cameras, multi-temperature recorders, RTDs) and correlating tests with simulations.
• Must-have: Ability to work cross-functionally with electrical, mechanical, and manufacturing teams to integrate thermal solutions into packaged hardware.
• Nice-to-have: Prior GPU, NPU card, or datacenter server thermal/card development experience.
• Nice-to-have: Familiarity with EM-thermal co-simulation workflows and power mapping tools (HFSS, SIwave, PowerDC).
• Nice-to-have: Business-level English communication skills.

Education Requirements

Not specified.

About the Company

Company: FuriosaAI

Headquarters: Seoul, South Korea

FuriosaAI develops high-performance, energy-efficient AI inference hardware and software. Founded in 2017 by semiconductor and AI engineers, the company builds AI-native compute platforms to reduce AI energy and operational costs and operates globally with offices in Korea, Silicon Valley, and an R&D lab in Lisbon.