Hardware Engineer, AI Accelerator Module Design

Job Title

Hardware Engineer, AI Accelerator Module Design

Role Summary

The Hardware Design, Rack-scale Technology and Platforms (HDRTP) team develops hardware platforms that power AI and HPC infrastructure. This individual-contributor role leads electrical and PCB design for AI accelerator modules across requirements, ASIC package-to-board co-design, schematic/layout, power delivery, bring-up, and volume production.

You will set module-level design methodology and standards, resolve cross-domain trade-offs (SI/PI/thermal/mechanical/cost), and mentor other PCB/module engineers.

Experience Level

Senior - requires substantial experience; minimum 10+ years in electrical and PCB design for high-speed, high-power digital systems.

Responsibilities

Primary responsibilities include ownership of module electrical architecture, cross-functional alignment, production readiness, and technical leadership.

• Own end-to-end electrical architecture and PCB design of AI accelerator modules for custom and third-party accelerators.
• Define module requirements and translate system-level targets into board-level design intent.
• Lead ASIC package-to-board co-design, breakout routing strategy, substrate/interposer interaction, and escape feasibility analysis.
• Architect power delivery networks for multi-hundred-amp loads, including DC-DC topology, decoupling strategy, and plane/stackup partitioning.
• Drive high-speed interface design across PCIe, CXL, UCIe, DDR5/LPDDR, HBM, NVLink, and Ethernet (up to 800G) with simulation-guided stackup and channel budgeting.
• Set SI/PI methodology and correlation strategy between simulation and measured hardware.
• Own module-level design reviews, DFM/DFT readiness, and bring-up, including root-cause analysis and corrective design actions.
• Drive ODM/JDM partners through NPI to mass production and maintain design standards and schedules.
• Develop reusable reference designs, design-rule libraries, and automation; evaluate and qualify advanced materials and technologies.
• Mentor PCB/module engineers and lead cross-functional technical initiatives.

Requirements

Must-have technical skills and demonstrated experience.

• 10+ years of electrical and PCB design experience for high-speed, high-power digital systems (servers, accelerators, networking, or HPC).
• Proven track record as lead engineer taking complex board or module designs from concept through volume production.
• Expert proficiency with EDA tools for schematic capture and PCB design (Cadence Allegro/OrCAD, Altium Designer, or equivalent).
• Deep expertise in high-speed digital interface and SerDes channel design, including stackup and channel budgeting (PCIe, CXL, DDRx, HBM, Ethernet 25G–800G).
• Deep expertise in power delivery network architecture for high-current loads, including transient and efficiency analysis and decoupling strategies.
• Experience with ASIC/GPU package-to-board co-design and breakout routing for high pin-count devices.
• Hands-on bring-up, debug, and failure analysis using oscilloscopes, VNAs, TDR, and power analyzers.
• Demonstrated ability to own technical direction across multiple concurrent programs and influence cross-functional organizations.
• Experience driving external ODM/JDM or component partners through design and production cycles.
• Strong written and verbal communication of technical trade-offs to engineering leadership.

Education Requirements

Minimum: BS in Electrical Engineering, Computer Engineering, or a related technical discipline. Preferred: MS or PhD in Electrical Engineering with emphasis on electromagnetics, signal integrity, or power electronics.

About the Company

Company: Meta Platforms

Headquarters: Menlo Park, California, United States

American technology company that develops social networking products (Facebook, Instagram, WhatsApp) and invests in virtual/augmented reality hardware and software through Reality Labs, focusing on connectivity, advertising, and immersive computing experiences.