Hardware Engineer

Job Title

Hardware Engineer

Role Summary

Lead end-to-end development of co-packaged optics (CPO) hardware, driving architecture, design, validation, and production transfer of integrated photonic/electronic systems.

Work as a technical lead coordinating Optical, Electrical, Mechanical, Firmware, and Software teams to meet performance, manufacturability, cost, and schedule targets.

Experience Level

Senior - expects an experienced technical lead. Typical requirement: multi-year senior-level experience (see Education Requirements for degree-specific thresholds).

Responsibilities

Accountable for product architecture, hardware design execution, validation, and manufacturing enablement for CPO products.

• Define CPO product architecture and subsystem interfaces (optical, mechanical, firmware, PCB) and manage key design tradeoffs.
• Champion decisions that balance performance, manufacturability, and cost.
• Provide technical guidance on photonic/electronic IC design, optical engine packaging, and substrate/PCB development.
• Lead detailed hardware design activities: schematic capture, circuit simulation, SI/PI analysis, and layout collaboration; integrate mechanical and fiber alignment considerations.
• Oversee prototype bring-up, system-level troubleshooting, and validation testing.
• Develop and drive project plans from concept through pilot builds to mass-production transfer; implement product development lifecycle processes.
• Define manufacturing test requirements and algorithms (ATE); provide manufacturing and customer technical support to resolve complex field issues.

Requirements

Must-have technical skills and leadership capabilities to execute complex hardware programs.

• Proven experience leading cross-functional R&D teams and delivering hardware products to production.
• Deep system-level expertise in integrated photonics and electronics or equivalent hardware systems experience.
• Practical hardware skills: schematic capture, circuit simulation, signal/power integrity analysis, layout collaboration, mechanical integration, prototype bring-up, and debugging.
• Experience managing manufacturing transfer, pilot builds, and defining production test requirements (ATE) and tuning algorithms.
• Strong ability to coordinate Optical, Electrical, Mechanical, Firmware, and Software stakeholders and to drive project schedules and milestones.
• Excellent problem-solving skills for system validation and field-issue resolution.

Nice-to-have:

• Experience with optical engine packaging, fiber alignment, and substrate/PCB development for co-packaged optics.
• Experience with photonic IC design and optical subsystem integration.

Education Requirements

Bachelor's degree in engineering or sciences with 12+ years of related experience; Master's degree with 10+ years; or Ph.D. with 7+ years of related experience. (Degrees in engineering or related scientific fields were specified.)

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.