FY27 MSIP Digital Design Engineering Intern (16-month)

Job Title

FY27 MSIP Digital Design Engineering Intern - 16-month (Toronto, ON, Canada)

Role Summary

Work on digital design for next-generation SerDes IP and high-speed interconnects targeting HPC and AI applications. The intern will implement and optimize digital modules, analyze test failures, and collaborate with verification, integration, analog, firmware, and physical design teams.

Experience Level

Entry-level internship (early-career). This role is intended for current undergraduate students.

Responsibilities

Typical responsibilities include:

• Learn SerDes and high-speed interconnect fundamentals.
• Design and implement digital modules using hardware description languages (e.g., SystemVerilog).
• Translate requirements/specifications into implementation plans.
• Debug and analyze test failures to identify and fix design bugs.
• Improve design workflows for efficiency and scalability.
• Apply industry-standard verification and design methodologies and tools.
• Use scripting and AI-enabled tools to accelerate development.
• Collaborate cross-functionally with verification, integration, systems, analog, firmware/software, physical design, and project management.
• Take on assigned tasks with mentorship and participate in team planning and coordination.

Requirements

Must-have and preferred skills for candidates (education items summarized separately below):

• Must-have: Digital logic / digital design experience; familiarity with Verilog/SystemVerilog.
• Experience with programming/scripting: Python, C/C++, Perl, and Linux/Unix environment.
• Working knowledge of ASIC design and simulation toolsets (synthesis, simulator) and basic ASIC design flow awareness.
• Strong problem-solving, analytical, communication, and organizational skills; self-driven and able to complete assigned tasks with mentorship.
• Nice-to-have: Exposure to SerDes, high-speed interconnect concepts, and experience with AI-enabled development tools or infrastructure.
• Ability to collaborate across engineering disciplines and take on small leadership responsibilities within project tasks.
• Note: This role may require export authorization for candidates from certain countries, which can delay start dates.

Education Requirements

Enrolled in an undergraduate program toward a bachelor’s degree in Electrical Engineering, Computer Engineering, Engineering Science, Computer Science, or a related field. Expected graduation date must be November 2028 or later for the 16-month internship. Candidates must be available for the 16-month period (May/June 2027 through August/September 2028). At least 1+ years of academic experience with programming languages such as C, C++, or Python is expected.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.