Frame Engineering Intern (Jan-Jun 2027)
Internship within the Tape Out organization at GlobalFoundries Singapore supporting frame engineering and tape-out operations. The role focuses on frame design, frame generation, and process improvements to improve productivity, quality, and cycle time for wafer fabrication and mask house interfaces.
The intern will work with worldwide Frame engineers and cross-functional teams (Application Engineering, Product Engineering, Release, Design Enablement, FAB/TD) to support production tape-outs and continuous process improvement activities.
Entry-level internship β targeted at current undergraduate students. No prior full-time experience required; previous internship or co-op experience is a plus.
The intern will support daily tape-out operations and projects to automate and improve frame engineering workflows.
Must-have technical skills and availability for the internship period are listed below. Education details are summarized separately under Education Requirements.
Actively pursuing a Bachelor's degree (B.S./B.Eng. or equivalent) in Chemical Engineering, Electrical/Electronic Engineering, Mechanical Engineering, Physics, or a related technical field through an accredited program. Must be available for a 16β24 week credit-bearing internship starting January 2027 and be in good academic standing.
Company: GlobalFoundries
Headquarters: Saratoga Springs, New York, USA
GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.
