External Package Innovation Engineer

Job Title

External Package Innovation Engineer

Role Summary

The External Package Innovation Engineer leads external package innovation initiatives and coordinates with outsourced assembly and test (OSAT) partners from concept through production. The role combines strategic ownership of OSAT-wide standards, roadmaps and governance with hands-on support for NPI/NTI project delivery at external sites.

Experience Level

Mid-level. No specific years-of-experience stated.

Responsibilities

Lead strategic OSAT initiatives and support project execution at external assembly/test partners.

• Own and lead OSAT-wide and cross-OSAT initiatives; define and deploy standard development templates and success criteria.
• Develop and maintain technology roadmaps and capability assessments for OSAT sites.
• Drive deployment of Best Known Methods (BKM) and capture lessons learned.
• Provide package innovation input for external site sourcing strategy and participate in site selection.
• Lead project governance activities: project summaries, stoplight reporting, and regular site reviews.
• Support NPI and NTI projects executed at external OSAT factories and ensure compliance with development processes and documentation.
• Coordinate SME assignments at OSATs and resolve technical and project issues across time zones, including on-site support.
• Ensure assembly readiness and safe production launch at external sites.
• Collaborate with cross-functional teams including project leaders, designers, materials engineers, and modeling and packaging SMEs.

Requirements

Key required skills and desirable additions.

• Must have: Strong experience in semiconductor packaging with hands-on assembly process experience (for example pre-assembly and wire bonding).
• Must have: Proven ability to manage cross-site, cross-functional projects and familiarity with NPI/NTI development flows.
• Must have: Strong stakeholder management and communication skills; ability to drive standardization, governance, and technical problem-solving.
• Nice to have: Prior exposure to the OSAT ecosystem and experience working with API, WLP/PLP/FC packaging technologies or test partners.
• Nice to have: Experience collaborating with electrical, mechanical and thermal modeling teams.

Education Requirements

Not specified.

About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.