Experienced Engineer OPC

Job Title

Experienced Engineer, OPC

Role Summary

Lead development and qualification of optical proximity correction (OPC), sub-resolution assist feature (SRAF), and resolution enhancement technique (RET) recipes for critical layers on FDX and FFX technology platforms. Own production-grade OPC flows, automation, and cross-functional patterning issue resolution within a semiconductor fab environment.

Experience Level

Mid-level — minimum 5 years of relevant hands-on experience in OPC, RET, or computational lithography.

Responsibilities

The core responsibilities include:

• Develop, qualify, and maintain OPC, SRAF, and RET recipes for critical layers on FDX and FFX.
• Build and optimize production OPC flows using Siemens EDA Calibre (nmOPC, OPCverify, nmSRAF, WORKbench) and ASML/Brion Tachyon (MB-OPC/MB-SRAF, LMC).
• Develop automation, recipe infrastructure, and analysis frameworks using Python and TCL; enforce coding standards and reuse.
• Perform lithography hotspot detection, LMC verification, and process-window analysis; remediate hotspots via OPC, SRAF, and source/mask co-optimization.
• Optimize runtime, turnaround time, and compute-resource usage for large-cluster production OPC jobs.
• Lead cross-functional technical investigations and collaborate with integration, etch, metrology, mask shop, and design teams.
• Mentor junior and mid-level engineers; review recipes, code, and methodologies.
• Represent the OPC team in technical reviews with EDA and scanner vendors; document methodologies and best practices.

Requirements

Must-have technical skills and experience:

• Minimum 5 years of hands-on experience in OPC, RET, or computational lithography in semiconductor manufacturing or advanced R&D.
• Production-level expertise with Siemens EDA Calibre OPC tool suite (nmOPC, OPCverify, nmSRAF, WORKbench).
• Production-level expertise with ASML/Brion Tachyon OPC platform (MB-OPC/MB-SRAF, LMC).
• Demonstrated experience with FDX (FD-SOI) and FFX (FinFET) platforms and their patterning challenges.
• Proficiency in Python and TCL for recipe development, automation, and large-scale data analysis.
• Solid understanding of optical lithography fundamentals, resist modeling, mask manufacturing constraints, and process window concepts.
• Experience operating large compute clusters and managing long-running, resource-intensive computational jobs.
• Excellent English skills (C1); German language skills preferred.

Nice-to-have:

• Familiarity with source-mask co-optimization (SMO), inverse lithography (ILT), or machine-learning-assisted OPC methods.
• Knowledge of mask data preparation (MDP), fracturing, and mask process correction (MPC).
• Experience with additional scripting/programming languages (Perl, C++, shell) and software engineering practices (Git, code review, CI).
• Experience with immersion ArF lithography and interfacing with design teams on DFM/DRC rules.

Education Requirements

Master's degree in Electrical Engineering, Physics, Optics, Materials Science, or a related discipline is required. A PhD is beneficial.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.