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Executive Director, R&D Engineering — 3DIC & Advanced Packaging

Synopsys
June 10, 2026
Full-time
On-site
Sunnyvale, California, United States
$268,000 - $402,000 USD yearly
Semiconductor IP Jobs, Level - Senior

Job Title

Executive Director, R&D Engineering — 3DIC & Advanced Packaging

Role Summary

Lead Synopsys engineering for 3DIC silicon IP and advanced packaging, driving technical strategy, product execution, and cross-functional delivery. Deliver solutions for AI infrastructure and high-performance computing through design, verification, and collaboration across global teams.

Experience Level

Senior — recommended 15+ years of semiconductor industry experience with demonstrated leadership and technical depth in advanced packaging and 3DIC technologies.

Responsibilities

Accountable for technical leadership, product execution, and cross‑functional collaboration to deliver 3DIC and advanced packaging silicon IP.

  • Lead design and verification across layout, physical design, signal and power integrity, thermal modeling, and mechanical integrity for AI/HPC products.
  • Manage collaboration with EDA tool development, product management, go‑to‑market, manufacturing, and Customer Success teams.
  • Define and execute technology roadmaps and product plans for 3DIC and advanced packaging offerings.
  • Monitor industry trends to prioritize innovations and align solutions to market and customer needs.
  • Hire, develop, and scale high‑performing, multi‑site engineering teams and processes.

Requirements

Core technical and leadership qualifications required to perform the role.

  • 15+ years of semiconductor industry experience with demonstrated depth in advanced packaging and 3DIC technologies.
  • Proven hands‑on and organizational expertise in 3DIC architectures, including chiplets, heterogeneous integration, and die‑to‑die interconnects.
  • Strong knowledge of 3DIC design and signoff challenges: signal and power integrity, thermal behavior, mechanical stress, reliability, and yield.
  • Track record of delivering complex 3DIC technologies from architecture through production and driving end‑to‑end silicon IP execution with tradeoff decisions across performance, power, area, cost, and manufacturability.
  • Experience building, leading, and scaling large, multi‑site engineering organizations.
  • Ability to define long‑term technical vision and influence cross‑functional stakeholders in a matrixed, global environment.
  • Strong customer‑facing leadership; experience engaging with leading customers and ecosystem partners to shape requirements and drive adoption.

Education Requirements

B.S. or M.S. in Electrical Engineering or a related technical discipline, or equivalent professional experience. (Equivalent practical experience explicitly accepted.)


About the Company

Company: Synopsys

Headquarters: Mountain View, California, USA

Synopsys is a leading company in electronic design automation (EDA) and semiconductor IP solutions. It provides tools and services for designing and verifying complex semiconductor devices and systems. The company plays a pivotal role in the semiconductor industry, helping engineers innovate and deliver higher-quality products faster. Synopsys is committed to advancing technology standards and offers a range of software and hardware solutions to its clients globally.

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Date Posted: 2026-06-07