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EUV Mask Technology RND Engineer

Micron Technology
August 17, 2026
Full-time
On-site
Boise, Idaho, United States
Process Engineering Jobs, Level - Entry or Early Career

Job Title

EUV Mask Technology RND Engineer

Role Summary

Join Micron’s Mask Technology Center (MTC) R&D team to develop materials, films, and processes for next‑generation AI‑assisted EUV and High‑NA EUV lithography. The role focuses on translating lithography requirements into manufacturable mask solutions, advancing High‑NA readiness, and partnering with engineering teams and suppliers to transfer technologies into FEOL process engineering.

Experience Level

Entry-level / Early Career — requires approximately 2+ years of relevant experience in semiconductor manufacturing, process development, or equivalent academic research.

Responsibilities

Core responsibilities include:

  • Develop AI‑assisted EUV mask blank materials and processes: film stack design, deposition, etch, clean, and patterning quality.
  • Advance High‑NA EUV readiness through material selection, mask design and stitching, lithography performance optimization, and lifetime improvement.
  • Translate lithography and OPC requirements into robust, manufacturable mask solutions in collaboration with OPC, design, and lithography teams.
  • Plan and execute data‑driven R&D (DOE and fundamental analysis) to improve yield, reliability, and manufacturability.
  • Collaborate with cross‑functional engineering teams and equipment suppliers to transition new technologies into FEOL process engineering.

Requirements

Must-have and preferred technical qualifications:

  • Must: 2+ years of experience in semiconductor manufacturing, process development, or equivalent academic research in semiconductor technologies.
  • Must: Hands-on experimental and process development skills in thin films, deposition, etch, cleaning, or patterning quality control.
  • Must: Experience designing and analyzing DOE and other data-driven experiments to improve yield and manufacturability.
  • Must: Demonstrated ability to work cross-functionally and communicate technical requirements to OPC, lithography, design, and equipment teams.
  • Nice-to-have: Direct experience with mask, lithography, or wafer fabrication environments (EUV, DUV, or advanced nodes).
  • Nice-to-have: Experience with actinic mask inspection, defect printability analysis, mask repair, or mask-to-wafer correlation.
  • Nice-to-have: Experience defining tool requirements, specifications, and roadmap strategy; working with semiconductor equipment suppliers on early-stage tool or process development.
  • Nice-to-have: Experience with lithography simulation, OPC, or mask pattern design for advanced nodes.

Education Requirements

MS or PhD in Materials Science, Physics, Chemistry, Chemical Engineering, or a related field. Equivalent academic research experience in semiconductor technologies may be considered.


About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

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Date Posted: 2026-08-17