EUV Mask Technology R&D Engineer

Job Title

EUV Mask Technology R&D Engineer

Role Summary

Join the Mask Technology Center R&D team to develop EUV mask materials and processes that enable High‑NA EUV manufacturing. The role focuses on film stack design, deposition, etch, cleaning, patterning quality, and translating lithography requirements into manufacturable mask solutions.

Work cross‑functionally with materials science, lithography, OPC, design, equipment suppliers, and FEOL process engineering to advance mask readiness and transition new technologies to production.

Experience Level

Entry-level / Early Career — typically requires 2+ years of relevant semiconductor or academic research experience.

Responsibilities

Primary responsibilities include:

• Develop and optimize EUV mask blank materials and processes (film stack design, deposition, etch, clean, and pattern quality).
• Advance High‑NA EUV readiness through material selection, mask design, stitching, lithography performance optimization, and lifetime improvements.
• Translate lithography and OPC requirements into robust, manufacturable mask solutions in collaboration with design and lithography teams.
• Design and execute data‑driven R&D (DOE, statistical and fundamental analysis) to improve yield, reliability, and manufacturability.
• Collaborate with cross‑functional engineering teams and suppliers to qualify and transition technologies into FEOL process engineering.

Requirements

Must-have and preferred skills (must-have items first):

• Must-have: 2+ years of semiconductor manufacturing or process development experience, or equivalent academic research experience in semiconductor technologies.
• Must-have: Hands-on process development experience (deposition, etch, cleaning, patterning) and demonstrated use of DOE and data-driven analysis.
• Must-have: Ability to translate lithography requirements into manufacturable mask solutions and work effectively with OPC, design, and lithography teams.
• Nice-to-have: Direct experience with EUV, High‑NA EUV, DUV, actinic mask inspection, defect printability analysis, or mask repair.
• Nice-to-have: Experience defining tool requirements/specifications, working with equipment suppliers, lithography simulation, OPC, or mask pattern design for advanced nodes.
• Nice-to-have: Deep understanding of lithography fundamentals, mask-to-wafer correlation, and pattern transfer fidelity.

Education Requirements

MS or PhD in Materials Science, Physics, Chemistry, Chemical Engineering, or a related field. Candidates with equivalent academic research or practical experience in semiconductor technologies may be considered.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.