Engineer, Semi Packaging Engineering
Analog DevicesJob Title
Engineer, Semi Packaging Engineering
Role Summary
Responsible for designing, developing, and qualifying semiconductor packaging solutions (wire-bond, flip-chip, system-in-package, and module-based products) that meet reliability, manufacturability, and cost targets. Collaborates with product, quality, reliability, external OSATs, substrate suppliers, and material vendors to drive package architecture selection, process development, and product qualification.
Expected wage range for a new hire: $75,200 to $103,400 (annual). Benefits include medical, vision, dental, 401(k), paid time off, and performance-based bonus.
Experience Level
Entry-level. Posting requests 2+ years of hands-on semiconductor packaging experience; typically fits candidates with 0–3 years of experience.
Responsibilities
Key responsibilities include:
- Lead design, development, and qualification of semiconductor packaging solutions (wire-bond, flip-chip, SiP, modules).
- Perform mechanical and thermal analysis to support architecture selection, design optimization, and reliability risk assessment.
- Develop and maintain package design guidelines, process specifications, simulation methodologies, and technical documentation.
- Work with product, quality, and reliability teams to define reliability criteria and qualification plans.
- Collaborate with OSAT partners, substrate suppliers, and material vendors to resolve technical issues and optimize manufacturing processes.
- Support yield improvement and transfer of designs to manufacturing.
Requirements
Must-have skills and experience:
- 2+ years hands-on experience in semiconductor packaging development, package simulation, or packaging manufacturing.
- Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
- Knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
- Strong analytical, problem-solving, communication, and collaboration skills; ability to influence technical decisions across teams.
- Willingness to travel up to 10%.
Nice-to-have:
- Experience with ANSYS, FloTHERM, Sigrity, or Icepak.
- Experience with SolidWorks or AutoCAD.
Education Requirements
Master's degree in Mechanical Engineering or Electrical Engineering required. Posting is listed as a graduate-level role.
About the Company
Company: Analog Devices
Headquarters: Norwood, Massachusetts, USA
Analog Devices is a leading global semiconductor company that bridges the physical and digital worlds, enabling breakthroughs at the Intelligent Edge. With a focus on innovation, ADI develops solutions that drive advancements in digitized factories, mobility, and digital healthcare. The company employs around 24,000 people globally and reported revenues exceeding $9 billion in FY24, creating technologies that transform lives across various sectors.
