Engineer - QEM PQE Electrical Failure Analysis

Job Title

Engineer - QEM PQE Electrical Failure Analysis

Role Summary

The QEM PQE Electrical Failure Analysis (EFA) Engineer performs die-level electrical analysis and failure-mode construction to resolve yield, quality, and reliability issues for advanced NAND memory products manufactured at Fab 10N/X. The role supports new product introduction (NPI) and high-volume manufacturing (HVM) through characterization, root-cause analysis, and translating findings into test, process, or design improvements.

Experience Level

Mid-level engineer. No explicit years of experience stated.

Responsibilities

Key responsibilities include electrical failure analysis, experimental design, and cross-functional issue resolution.

• Perform die-level electrical failure analysis using bench characterization to identify failure mechanisms at die, circuit, and transistor levels.
• Construct failure models and root-cause analyses for yield excursions, reliability issues, and customer return cases.
• Design and execute probe-engineering experiments and bench DOEs to validate hypotheses and drive yield/quality improvement.
• Translate characterization results into test, process, or device optimization solutions to improve yield, reliability, and product quality.
• Conduct circuit and layout tracing to correlate electrical failure signatures with physical or process limitations.
• Support NPI qualification and HVM issue resolution to ensure timely product release and manufacturing stability.
• Drive data-driven yield improvement programs through collaboration with cross-functional teams (PI, TD, PE, TSE, YE).
• Develop custom test conditions, scripts, and methodologies for advanced failure validation and experiment execution.
• Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, and effectiveness.

Requirements

Core technical and interpersonal requirements. Degree requirements are listed in the Education Requirements section below and have been removed from this list to avoid duplication.

• Hands-on experience in electrical failure analysis, bench characterization, probe testing, test flow understanding, data analysis, and DOE methodology.
• Strong understanding of NAND memory operation and architecture, CMOS device physics, and wafer fabrication processes.
• Knowledge of circuit analysis, layout tracing, yield analysis, and failure mechanisms.
• Excellent problem-solving and analytical skills; ability to troubleshoot complex interactions among test conditions, probe limitations, and device design.
• Proven written and verbal communication skills and ability to manage multiple complex projects to completion.
• Strong teamwork and ability to build effective cross-functional relationships.
• Baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively.
• Nice-to-have: experience with probe engineering, test automation scripting, or prior NPI/HVM semiconductor experience.

Education Requirements

Bachelor's or Master's degree in Electronics, Microelectronics, Materials Science, Physics, or Applied Science.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.