Job Title
Engineer, Product Engineering (Media Health Reliability), Heterogeneous Integration - High Bandwidth Memory
Role Summary
Work on product reliability for High Bandwidth Memory (HBM) within the Heterogeneous Integration group. Define reliability stress and test flows, drive qualification execution, root-cause failures, and recommend process changes to improve yield, quality, and reliability.
Collaborate with fab, design, system development, and quality teams; embed AI and applied machine-learning techniques into reliability workflows to accelerate analysis and decision making.
Experience Level
Mid-level (Level - Mid-Career). Typical experience: 3β7 years in semiconductor product engineering, reliability, or related roles.
Responsibilities
Key responsibilities include defining test plans, executing qualifications, investigating failures, and driving improvements across manufacturing and test flows.
- Define and develop reliability stress tests, test flows, and qualification plans for product reliability.
- Coordinate with Global Quality to manage qualification execution and resolve gating issues.
- Reduce extrinsic and intrinsic reliability failures (DPM reduction) through optimized test flows and strategies.
- Perform root-cause analysis using electrical and physical failure analysis and drive cross-functional corrective actions.
- Recommend process conversions and manufacturing improvements to increase yield and reduce cost.
- Assess and manage risks associated with process conversions in collaboration with product managers and leads.
- Promote technical innovation and make technical decisions on risk analysis and project prioritization.
- Develop project management skills to ensure timely delivery of reliability initiatives.
- Identify and scope AI/ML use cases for reliability data; apply ML methods (regression, classification, anomaly detection, clustering) to segment failures and detect outliers.
Requirements
Must-have skills and expectations, plus a few preferred items.
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Must-have: Familiarity with CMOS technology, DRAM architecture, and basic device physics.
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Must-have: Experience with data analysis and scripting tools (e.g., Python, JMP) and practical application of statistics.
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Must-have: Strong problem-solving and root-cause analysis skills; attention to detail and commitment to quality.
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Must-have: Effective communication skills and ability to work in cross-functional, team-based projects.
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Nice-to-have: Experience in semiconductor devices, circuit design, or product validation.
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Nice-to-have: Prior exposure to applied machine-learning workflows or AI-assisted analysis for reliability datasets.
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Other: Flexible, eager to learn, accountable, and able to take on diverse roles in a dynamic engineering environment.
Education Requirements
Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field (as stated in the posting).
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

Date Posted: 2026-08-05