Engineer, Product Engineering — Media Health Manufacturing (HIG-HBM)

Job Title

Engineer, Product Engineering — Media Health Manufacturing (HIG-HBM)

Role Summary

Technical contributor on the High Bandwidth Memory (HBM) Product Engineering — Media Health team. Responsible for driving manufacturing execution and product enablement for next-generation HBM products (DRAM die, interface die, and stacked HBM solutions).

Main accountabilities include manufacturing test flow development and validation, device- and stack-level yield improvement, reliability and test coverage optimization, and cross-functional execution with Fab, Design, Technology Development, and Test Solutions teams.

Experience Level

Mid-level (Level - Mid-Career). Typical background: approximately 3–7 years of relevant semiconductor engineering experience.

Responsibilities

Deliver technical solutions that enable high-volume HBM manufacturing and product quality.

• Define and optimize manufacturing test coverage for HBM design architectures and process nodes.
• Develop, validate, characterize, and qualify next-generation HBM products.
• Support design validation and circuit-level debug using CAD tools and Verilog simulations.
• Drive yield improvement and reduce test time for device, interface, and stacked-die issues.
• Investigate root causes and resolve manufacturing test flow, qualification (Qual), and RMA device issues.
• Contribute to Design-For-Test (DFT) strategy and implement innovative test strategies.
• Promote technical innovation to improve cost, cycle time, and product quality.
• Mentor and develop junior engineers; make technical decisions on risk and project prioritization.
• Collaborate cross-functionally with Fab, Technology Development, Design, System Development, and Quality/Reliability teams.
• Leverage AI-powered tools and automation to improve productivity and decision-making.

Requirements

Must-have technical skills and professional capabilities.

• Experience with semiconductor devices, circuit design, or product validation.
• Concrete problem-solving skills with a focus on root-cause analysis and corrective actions.
• Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
• Strong attention to detail and commitment to product quality.
• Effective written and spoken English communication; ability to present technical findings clearly.
• Proven ability to work effectively on team-based, cross-functional projects.
• Responsible, accountable, and adaptable in a dynamic engineering environment.

Nice-to-have:

• Experience with Verilog, CAD simulation tools, or DFT methodologies.
• Background in manufacturing test flow optimization, yield analysis, and cost reduction.
• Direct experience with HBM or stacked-die products and related test strategies.
• Familiarity with automation and AI tools applied to test and manufacturing workflows.

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.