Engineer, Packaging Test Engineering

Job Title

Engineer, Packaging Test Engineering

Role Summary

Position in the Advanced Packaging Process Integration & Yield Enhancement team supporting electrical test, product characterization, and yield-learning for 2.5D and 3D heterogeneous integration technologies (chiplets, interposers, TSV, hybrid bonding, multi-die stacking).

Hands-on role working with integration, design, process, product, reliability, equipment, and manufacturing teams to develop and qualify test methods and improve yield.

Experience Level

Entry-level. Candidates without prior work experience are welcome; comprehensive training will be provided.

Responsibilities

Primary responsibilities include developing and executing electrical test and characterization, supporting test hardware, analyzing data, and coordinating failure isolation and qualification activities.

• Develop, validate, and release electrical test methods for wafers, dies, interposers, package-level structures, and test vehicles.
• Perform electrical characterization experiments and collect data for process and product development under guidance.
• Support qualification, definition, and troubleshooting of probe cards, sockets, load boards, interface hardware, cables, and fixtures.
• Analyze test data to identify trends, outliers, failure signatures, and yield-loss mechanisms; prepare concise technical summaries.
• Support electrical fault isolation and coordinate with failure-analysis, integration, process, and reliability teams to verify corrective actions.
• Assist with test coverage reviews, guardband evaluations, reproducibility studies, and correlation across bench, wafer-sort, final-test, and reliability data.
• Contribute to process/product qualification, reliability readouts, engineering change evaluations, and manufacturing readiness.
• Drive continuous improvement in cycle time, test-time optimization, automation, data quality, and standardization of procedures and reports.
• Maintain test plans, specifications, procedures, experiment records, validation reports, and lessons learned following document-control practices.
• Collaborate with local and global teams, suppliers, and manufacturing partners; follow safety, quality, and compliance requirements.

Requirements

Must-have technical skills, tools, and behaviors. Preferred items listed separately.

• Basic understanding of semiconductor devices, electrical measurements, circuits, and data interpretation.
• Working knowledge of laboratory instruments (digital multimeters, oscilloscopes, source-measure units, power supplies, or parameter analyzers).
• Ability to analyze structured datasets using Excel or tools such as Python, JMP, or MATLAB.
• Strong problem-solving skills, attention to detail, and willingness to learn new technologies and tools.
• Strong written and verbal communication and ability to work effectively in cross-functional teams.
• Familiarity with document-control and laboratory/cleanroom safety practices.

Nice-to-have:

• Prior internship or co-op experience in related areas.
• Exposure to automated test equipment (ATE), wafer probing, package final test, bench characterization, or test-program development.
• Understanding of statistics, design of experiments (DOE), measurement-system analysis, statistical process control, or yield concepts.
• Awareness of advanced packaging technologies (2.5D/3D, TSVs, interposers, hybrid bonding, micro-bumps, HBM, SiP).
• Interest in leveraging AI tools to enhance productivity and workflows.
• Exposure to signal/power integrity, thermal effects, mechanical stress, or reliability considerations.

Education Requirements

Bachelor's degree in Electrical Engineering, Electronics Engineering, Computer Engineering, Microelectronics, Applied Physics, Materials Science, Mechanical Engineering, or a related technical field.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.