Engineer, Package Reliability
As a Package Reliability Engineer in Global Quality, you coordinate package qualification and reliability testing across assigned product lines. You lead qualification plans, analyze reliability data, and recommend product release decisions.
The role is cross-functional and involves working with manufacturing, failure analysis and customer teams to resolve qualification issues and maintain package quality.
Entry-level β minimum 1β2 years relevant experience in microelectronic packaging, reliability engineering, or failure analysis.
Primary duties include planning and executing package qualification, driving failure investigations, and interfacing with customers and internal teams.
Must-have technical skills and professional competencies.
Nice-to-have: experience with failure analysis, customer-facing technical support, or advanced statistical reliability modeling.
Bachelor's or Master's in Engineering (Mechanical, Electronics, Materials Science) or a related technical field. The posting specifies these degrees; relevant equivalent practical experience is noted in experience requirements.
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
