Engineer (New College Grad) - HBM Layout
Entry-level IC layout engineer on the HBM (High Bandwidth Memory) physical design team based in Jalisco, Mexico. The role focuses on creating and verifying custom layout for leaf cells, standard cells and sub-blocks and supporting physical verification flows.
Works closely with circuit designers and verification teams to ensure layouts meet timing, power, area and manufacturability targets.
Entry-level / New college graduate. Candidates should have graduated within the last 2 years (bachelor's, master's, or PhD).
Primary responsibilities include layout implementation, verification, and cross-team coordination.
Must-have technical skills and attributes; preferred items listed after.
Bachelor's, Master's, or PhD in Electronics, Mechatronics, Robotics, Nanotechnology, or a similar engineering/technical field. Candidates must have graduated within the last two years.
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
