Engineer II (Die Attach/Die Bond/Wire Bond)

Job Title

Engineer II (Die Attach/Die Bond/Wire Bond)

Role Summary

Responsible for end-to-end ownership of Die Attach and Wire Bond processes and equipment on a reel-to-reel (R2R) semiconductor assembly line. Deliver high equipment uptime, process stability, yield improvement and quality compliance while supporting new product introduction and continuous improvement.

Experience Level

Mid-level — typically 2–3 years of hands-on experience in Die Bond and/or Wire Bond process and equipment support in semiconductor backend manufacturing.

Responsibilities

Key responsibilities include maintaining process and equipment performance, troubleshooting yield and quality issues, and leading NPI and continuous improvement activities.

• Own and sustain Die Attach and Wire Bond processes and equipment to meet process specifications and high OEE.
• Manage tooling setup, calibration, alignment, and qualification.
• Provide daily process and equipment support to production for smooth operations and lot transitions.
• Perform DOE, FMEA and root-cause analysis for issues such as die tilt, voids, ball offset, wire lift, and non-stick.
• Optimize bonding parameters and validate process capability (Cpk) for products.
• Lead NPI activities: setup, conversion and buy-off for new products and material changes.
• Analyze equipment and process data (UPH, yield, downtime, alarms) using Spotfire, Power BI, Excel or similar tools.
• Implement digital controls and interlocks (recipe management, alarm limits, auto-locks) to reduce errors.
• Document SOPs, setup guides and troubleshooting standards; prepare performance and yield reports for management.
• Provide technical training and mentoring to technicians and operators.

Requirements

Must-have skills and experience for successful performance in this role.

Must-have

• 2–3 years hands-on experience in Die Bond and/or Wire Bond process and equipment support in semiconductor backend manufacturing.
• Hands-on experience with equipment setup, calibration, troubleshooting and optimization.
• Proven ability with structured problem-solving methods: DOE, FMEA, SPC, 8D.
• Ability to analyze manufacturing data using Excel, Spotfire, Power BI or equivalent tools.
• Solid understanding of OEE, yield improvement methods and process capability (Cpk).
• Experience supporting NPI, product conversion and material qualification.
• Strong communication and cross-functional collaboration skills; self-motivated and detail-oriented.

Nice-to-have

• Experience implementing digital recipe management, alarm configurations and automated interlocks.
• Experience presenting weekly yield/performance reports to management and leading cost-reduction projects.

Education Requirements

Bachelor's degree in engineering (Mechanical, Electrical, Electronics, Mechatronics or related engineering discipline) is specified.

About the Company

Company: Nexperia

Headquarters: Cabuyao, Philippines

Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.