Engineer II (DB & WB)

Job Title

Engineer II (DB & WB)

Role Summary

Responsible for end-to-end ownership of Die Attach (Die Bond) and Wire Bond process and equipment performance on a reel-to-reel (R2R) semiconductor assembly line. The role focuses on maintaining high equipment uptime, stable processes, yield improvement, and quality in a high-volume manufacturing environment.

The engineer provides hands-on technical support, drives continuous improvement and NPI activities, and collaborates with cross-functional teams to implement robust controls and resolve process or equipment failures.

Experience Level

Entry-level (2–3 years of relevant hands-on experience in Die Bond and/or Wire Bond process and equipment support).

Responsibilities

Day-to-day technical ownership and continuous improvement for Die Attach and Wire Bond stations.

• Own and sustain Die Attach and Wire Bond processes and equipment to meet OEE and process specifications.
• Manage tooling setup, calibration, alignment, and qualification.
• Provide daily production support to ensure smooth operations and lot transitions.
• Perform DOE, FMEA, and root-cause analysis for yield/quality issues (e.g., die tilt, voids, ball offset, wire lift, non-stick).
• Optimize bonding parameters and validate process capability (Cpk) for products.
• Lead NPI activities: setup, conversion, and buy-off for new products and material changes.
• Analyze equipment and process data (UPH, yield, downtime, alarms) and report performance to management.
• Drive cost reduction and productivity projects to reduce scrap and improve robustness.
• Implement digital controls and interlocks (recipe management, alarm limits, auto-locks).
• Document SOPs, setup guides, troubleshooting standards, and train technicians/operators.

Requirements

Key technical skills and experience required for effective performance in the role.

• Hands-on experience supporting Die Bond and/or Wire Bond processes and equipment in semiconductor backend manufacturing.
• Experience with reel-to-reel (R2R) assembly lines and high-volume production environments.
• Equipment setup, calibration, alignment, troubleshooting, and optimization skills.
• Practical knowledge of DOE, FMEA, SPC, 8D, and structured problem-solving methods.
• Ability to analyze manufacturing data using Excel, Spotfire, Power BI, or similar tools.
• Understanding of OEE, yield improvement, and process capability metrics (Cpk).
• Experience supporting new product introduction (NPI), product conversion, and material qualification.
• Strong communication and cross-functional collaboration skills; able to train and mentor operators/technicians.
• Self-motivated, detail-oriented, and able to work in a fast-paced manufacturing environment.

Education Requirements

Bachelor's degree in Engineering (Mechanical, Electrical, Electronics, Mechatronics, or related discipline) is specified in the posting.

About the Company

Company: Nexperia

Headquarters: Cabuyao, Philippines

Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.