Engineer I - Process (Grinding and Lamination)

Job Title

Engineer I - Process (Grinding and Lamination)

Role Summary

The Engineer I - Process (Backgrind) leads development, characterization, qualification, and industrialization of wafer thinning and backgrinding technologies to support advanced semiconductor packaging (WLCSP, BGA, MDQFN, Fan-Out, etc.).

The role drives NPI, process optimization, and manufacturing readiness while collaborating with Product Development, R&D, Equipment Engineering, Operations, Quality, and external suppliers.

Experience Level

Entry-level (Engineer I). Minimum 3 years of semiconductor manufacturing experience, with direct backgrinding and tape lamination experience recommended.

Responsibilities

Lead technical activities to develop robust, manufacturable wafer thinning and handling processes and transfer them to production.

• Lead development and qualification of wafer backgrinding and thinning processes for new products and platforms.
• Establish process architecture, process windows, and technology roadmaps for thinning applications.
• Drive innovation to enable thinner wafers, improved integrity, throughput, and cost effectiveness.
• Evaluate and implement new grinding technologies, materials, consumables, and equipment solutions.
• Define process flows, critical process parameters, and recipes to meet design, reliability, and manufacturability targets.
• Plan and execute process characterization to establish operating windows and margins; generate specifications, control plans, and qualification reports.
• Lead process transfer from development to pilot and high-volume manufacturing and support manufacturing during ramp and early production.
• Drive process stabilization and continuous improvement after production release.
• Serve as subject-matter expert for wafer and panel backgrinding, thin-wafer processing, tape lamination/detaping and cure processes, grinding wheel technologies, wafer handling/warpage management, and related areas.

Requirements

Must-have technical skills, hands-on experience, and professional behaviors for the role. Preferred items are noted.

• Minimum 3 years semiconductor manufacturing experience with direct experience in backgrinding and tape lamination processes.
• Practical experience with Design of Experiments (DOE) and statistical tools such as Minitab or JMP, SPC, FMEA, GRR, and Six Sigma methods.
• Familiarity with process characterization, recipe creation, and equipment/process troubleshooting.
• Ability to interpret SPC charts and analyze process data; strong analytical and problem-solving skills.
• Knowledge of safety protocols and cleanroom practices.
• Proficiency in MS Office and maintenance management systems.
• Leadership, mentoring capability, strong attention to detail, and a sense of accountability; effective verbal and written communication skills.
• Preferred: Experience with fan-in and fan-out advanced packaging tools and experience improving metallization performance and process capability.
• Willingness to travel up to 25%.

Education Requirements

Bachelor's degree in Electronics Engineering, Chemical Engineering, Materials Science Engineering, Mechanical Engineering, Semiconductor Engineering, Physics, or a related engineering discipline.

About the Company

Company: Microchip

Headquarters: Chandler, Arizona, USA

Microchip is a leading semiconductor company focused on developing innovative solutions to enhance the human experience. With a commitment to empowering innovation, Microchip prioritizes the value of its employees by fostering a culture that supports their growth and contributions.