Engineer, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

Job Title

Engineer, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

Role Summary

Individual contributor on the Package Development Engineering team supporting advanced packaging and HBM technologies in Singapore. The role focuses on transitioning new products from development into high-volume manufacturing and partnering with development, manufacturing, and supplier teams across Micron's network.

Experience Level

Entry-level / Early career — minimum 2 years of experience in the semiconductor industry (as stated in the posting).

Responsibilities

Primary responsibilities support NPI, process transfer, and manufacturing readiness:

• Integrate AI-assisted tools and insights into daily workflows to improve efficiency, quality, and effectiveness.
• Identify, test, and share AI-enabled and continuous improvement enhancements within assigned scope.
• Apply engineering and statistical methods (DOE, SPC) to accelerate learning cycles and product qualification.
• Partner with Advanced Package Technology Development (APTD), manufacturing, and suppliers to support Low Volume Manufacturing (LVM) and Run at Risk (RAR).
• Perform risk assessments (FMEA), implement control plans, and drive corrective actions for abnormal conditions.
• Enable smooth technology transfer from development to high-volume manufacturing.
• Provide operations support, including shift and weekend coverage as required.

Requirements

Must-have technical skills, experience, and behaviors:

• Minimum 2 years of experience in a semiconductor-related field.
• Experience with fan-in packaging processes or advanced packaging technology.
• Proficiency with statistical and experimental methods: SPC, DOE, and JMP.
• Strong analytical, logical, and critical thinking skills; effective cross-level communication.
• Ability to support operations (shifts and weekend coverage) and to enable manufacturing transfers.
• Baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively.

Nice-to-have / preferred:

• Familiarity with MES, automation, and data analytics tools (e.g., JMP, Python).
• Internship or prior hands-on experience in the semiconductor industry.
• Demonstrated leadership and measurable impact in prior roles.
• Knowledge of Micron products and the semiconductor market.

Education Requirements

Bachelor's degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or a related discipline (as specified in the posting).

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.