Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)

Job Title

Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)

Role Summary

Technical contributor on the High Bandwidth Memory (HBM) Product Engineering – Media Health team responsible for manufacturing execution and product enablement for next-generation HBM (DRAM die, interface die, stacked solutions).

Accountable for manufacturing test flow development and validation, yield and reliability improvement, test-time reduction, and coordination with cross-functional teams to deliver cost-, quality-, and cycle-time targets.

Experience Level

Mid-level engineer. Typical candidates have several years of relevant semiconductor engineering experience (not explicitly quantified in the source).

Responsibilities

Primary technical and cross-functional responsibilities include:

• Develop, validate, and optimize manufacturing test flows for HBM die, interface die, and stacked products.
• Improve device- and stack-level yield through root-cause analysis and corrective actions.
• Reduce manufacturing test time and improve test coverage and efficiency.
• Perform deep circuit debug, Verilog/CAD-based simulations, and failure analysis for new designs.
• Drive Design-For-Test (DFT) strategy and introduce test innovations to lower cost and cycle time.
• Collaborate with Fab, Design, Technology Development, Test Solutions, and Quality/Reliability teams on tactical and strategic deliverables.
• Mentor and develop less-experienced engineers and contribute to project management and technical prioritization.
• Leverage automation and AI-powered tools to improve productivity and decision-making.

Requirements

Must-have technical skills and attributes:

• Experience with semiconductor devices, circuit design, or product validation.
• Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Hands-on experience with test development, yield improvement, or manufacturing test flows.
• Data analysis and statistics experience; familiarity with scripting tools such as Python or JMP.
• Strong problem‑solving and root‑cause analysis skills.
• Effective written and spoken English for technical communication.
• Ability to work in team-based projects and collaborate across functions; accountable and detail-oriented.

Nice-to-have:

• Experience with Verilog simulations or CAD tools for design validation.
• Prior work on stacked-die products or advanced memory technologies.

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering or a related technical field (as stated in the source).

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.