Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)

Job Title

Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)

Role Summary

Technical contributor on the High Bandwidth Memory (HBM) Product Engineering — Media Health team focused on manufacturing execution for next-generation HBM products (DRAM die, interface die, stacked HBM).

Primary responsibilities include manufacturing test flow development and validation, yield improvement, reliability optimization, test time reduction, and DFT strategy in close collaboration with Fab, Design, Technology Development, Test Solutions, and Product leads.

Experience Level

Mid-level (no explicit years of experience provided).

Responsibilities

Key deliverables and day-to-day responsibilities:

• Drive manufacturing execution and ownership across Quality, Cost, Cycle Time, and Scale for HBM products.
• Develop, validate, and maintain manufacturing test flows and ensure optimized test coverage for current and future HBM architectures.
• Perform device- and stack-level yield analysis; lead root-cause investigations and resolve qual and RMA device issues.
• Debug circuits, optimize test coverage, and contribute to Design-For-Test (DFT) strategies to improve reliability and reduce cost and cycle time.
• Implement test-time reduction and efficiency improvements, including automation and AI-powered tools to streamline workflows.
• Collaborate cross-functionally with Fab, Design, Technology Development, Test Solutions, Product leads, and Quality/Reliability teams to execute strategic and tactical deliverables.
• Mentor and develop less-experienced engineers; make technical decisions on risk analysis and project prioritization.
• Manage project timelines and deliverables to support high-volume manufacturing readiness.

Requirements

Must-have technical skills and professional behaviors:

• Experience with semiconductor devices, circuit design, or product validation in a manufacturing environment.
• Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Hands-on experience with manufacturing test flows, yield improvement, and test-time reduction activities.
• Proficiency in data analysis and statistics; experience with scripting or analysis tools such as Python or JMP.
• Strong problem-solving and root-cause analysis skills.
• Effective written and verbal communication in English and the ability to work in cross-functional teams.
• Attention to detail, accountability, adaptability, and willingness to take on diverse roles in a dynamic engineering setting.

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering or a related technical field (as stated in the posting).

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.