Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)

Job Title

Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)

Role Summary

Technical contributor on the High Bandwidth Memory (HBM) Product Engineering – Media Health team focused on manufacturing execution for next-generation HBM products (DRAM die, interface die, and stacked HBM solutions).

Primary responsibilities include developing and validating manufacturing test flows, improving device and stack-level yield, reducing test time, and working with cross-functional teams to deliver quality, cost, cycle time, and scale improvements.

Experience Level

Mid-level. No specific years of experience required or stated.

Responsibilities

Accountable for production-ready test and manufacturing solutions for HBM products and for collaborating across teams to resolve yield and reliability issues.

• Develop, validate, and maintain manufacturing test flows for DRAM, interface die, and stacked HBM devices.
• Optimize test coverage and implement Design-for-Test strategies for current and future HBM architectures.
• Investigate yield and reliability issues; perform root-cause analysis and implement corrective actions.
• Reduce manufacturing test time and improve cycle time and cost through test and flow optimization.
• Support design verification and circuit debug using CAD tools and Verilog simulations.
• Drive extrinsic and intrinsic reliability improvements at device and stack level.
• Lead cross-functional problem solving with Fab, Design Engineering, Technology Development, and Test Solutions teams.
• Mentor colleagues and contribute to project planning and technical decision-making.

Requirements

Core technical skills, behaviors, and tools expected for successful performance in this role.

• Must-have: Solid problem-solving skills with demonstrated root-cause analysis capability.
• Must-have: Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Must-have: Experience or exposure to data analysis and statistics; ability to work with scripting or analysis tools (examples: Python, JMP).
• Must-have: Strong attention to detail, commitment to product quality, and effective written and spoken English communication skills.
• Must-have: Ability to work effectively in team-based projects and collaborate across functions.
• Nice-to-have: Hands-on experience with CAD tools, Verilog simulations, manufacturing test equipment, or previous semiconductor/test engineering internships.

Education Requirements

Bachelor's or Master’s degree in Electrical and Electronics Engineering or a related technical field. Coursework or internship experience in semiconductor devices, circuit design, or product validation is a plus.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.