Job Title
Engineer, HIG HBM, Product Engineering (Media Health Reliability)
Role Summary
As an engineer on the HIG HBM Product Engineering β Media Health Reliability team, you will develop and execute reliability test flows and qualification plans for High Bandwidth Memory (HBM) products, troubleshoot reliability failures, and drive improvements across manufacturing and product development. The role partners with fab, technology, design, system, and quality teams to reduce DPM, manage risk during process conversions, and enable high-volume manufacturing.
This work ensures HBM products meet quality and reliability targets for advanced computing systems.
Experience Level
Mid-level. Years of experience not specified.
Responsibilities
Primary responsibilities include developing reliability tests and plans, managing qualifications, performing root-cause analysis, and driving cross-functional improvements.
- Define and develop reliability stress tests, test flows, and test plans covering product reliability aspects.
- Collaborate with Global Quality to define qualification plans, track execution progress, and resolve gating issues.
- Drive reductions in extrinsic and intrinsic DPM through optimized manufacturing test flows and test strategy.
- Perform root-cause analysis of reliability and RMA issues using electrical and physical failure analysis and lead corrective actions.
- Recommend process conversions and improvements to fab teams to improve yield, cost, and performance.
- Manage risks and communicate with product managers/leads during process conversions.
- Promote technical innovation, make technical risk and prioritization decisions, and support project management.
- Mentor and develop team members and collaborate across Fab, HBM technology, design, system development, and quality teams.
- Execute hardware, software, or semiconductor engineering tasks as required.
Requirements
Must-have skills and attributes; formal degree requirements are listed separately under Education Requirements.
- Solid problem-solving methodology and root-cause analysis skills.
- Familiarity with CMOS technology, DRAM architecture, and basic device physics.
- Experience with data analysis, statistics, and scripting tools (Python, JMP, or similar).
- Strong attention to detail, commitment to quality, and accountability for results.
- Effective verbal and written technical communication and ability to work in cross-functional teams.
- Flexible, eager to learn, and able to take on diverse roles in a dynamic engineering environment.
- Nice-to-have: experience in semiconductor devices, circuit design, or product validation.
Education Requirements
Bachelor's or Master's degree in Electrical and Electronics Engineering or a related technical field.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

Date Posted: 2026-06-10