Engineer, HIG HBM Layout

Job Title

Engineer, HIG HBM Layout

Role Summary

As a Layout Engineer on Micron's HBM team in Hyderabad, you will create and verify block-level and chip-level layouts for High Bandwidth Memory (HBM) in advanced CMOS processes. The role involves coordinating with global teams to meet schedules and deliver high-quality layouts for AI and high-performance computing applications.

Experience Level

Mid-level - approximately 2–5 years' experience in analog/custom layout design in advanced CMOS processes (Planar, FinFET).

Responsibilities

Primary responsibilities include development, verification, delivery of layouts, and cross-team coordination.

• Design and develop critical analog, mixed-signal and custom digital blocks and support full-chip integration.
• Perform physical verification (LVS/DRC/Antenna), quality checks, and produce supporting documentation.
• Deliver block-level layouts on time with acceptable quality.
• Estimate area/time, manage schedules, and meet project milestones across multiple projects.
• Guide and review peer team members on sub-block layouts and critical items.
• Coordinate effectively with local and global engineering teams to ensure successful execution.

Requirements

Must-have skills, tools, and experience, plus a few desirable additions.

• 2–5 years' experience in analog/custom layout design for advanced CMOS processes (Planar and FinFET).
• Proficient with Cadence VLE/VXL and Mentor Graphics Calibre DRC/LVS.
• Hands-on experience creating layouts for critical blocks: temperature sensors, PLLs, ADCs, DACs, LDOs, bandgaps, reference generators, charge pumps, current mirrors, comparators, differential amplifiers.
• Strong understanding of analog layout fundamentals: matching, electromigration, latch-up, coupling, crosstalk, IR-drop, and parasitic effects.
• Understanding of layout impacts on speed, capacitance, power and area; ability to implement design constraints to achieve high-quality layouts.
• Problem-solving skills in physical verification of custom layouts; excellent verbal and written communication skills.
• Nice-to-have: experience supporting multiple tape-outs; involvement in test-vehicle builds and validation (electrical, thermal, mechanical) with HIG-HBM DTPCO teams.

Education Requirements

BE or MTech in Electronics or VLSI Engineering. Exceptionally talented Diploma holders in electronics or VLSI may be considered.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.