Engineer, HIG HBM

Job Title

Engineer, HIG HBM

Role Summary

Engineer responsible for reliability, qualification, and manufacturing test strategy for Heterogeneous Integration (High Bandwidth Memory) at Fab 10A, Singapore. The role develops reliability stress and test flows, drives DPM reduction, performs root-cause analysis, and supports process conversions into high-volume manufacturing.

Works cross-functionally with fab, technology development, design, systems, and quality teams to ensure product reliability, yield, cost, and schedule targets are met.

Experience Level

Mid-level. No specific years-of-experience stated.

Responsibilities

Key responsibilities include developing and executing reliability and qualification activities, debugging failures, and recommending process or test changes to improve product reliability and manufacturability.

• Define and develop reliability stress tests, test flows, and test plans covering product reliability aspects.
• Collaborate with Global Quality to define qualification plans, track execution, and resolve qualification gating issues.
• Drive reduction of Extrinsic (Time‑0 and Field) and Intrinsic reliability issues via optimized manufacturing test flows and strategies.
• Perform root-cause analysis of reliability, quality, and RMA issues using electrical and physical failure analysis; drive corrective actions across teams.
• Recommend and support process conversions and HVM transfers to improve yield, cost, and reliability.
• Assess and communicate risks to product managers and leads; prioritize risk mitigation activities.
• Promote technical innovation and lead technical decision-making on risk analysis and project prioritization.
• Manage projects and coordinate cross-functional activities to deliver timely technical solutions.

Requirements

Must-have technical skills and professional behaviors for successful performance in this role.

Must-have:

• Solid problem-solving skills with focus on root-cause identification and solution exploration.
• Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Experience with data analysis, statistics, and scripting tools such as Python or JMP.
• Strong attention to detail and commitment to quality.
• Ability to work effectively in team-based, cross-functional projects.
• Flexible, eager to learn, responsible, and accountable for assigned tasks.
• Clear written and spoken English communication, especially for technical concepts.

Nice-to-have:

• Experience with reliability test execution, qualification planning, or manufacturing test flow optimization.

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field. Coursework or internship experience in semiconductor devices, circuit design, or product validation is listed as a plus.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.