Engineer - HIG - HBM Design
Design and analyze digital and analog circuits for memory products, focusing on high-bandwidth memory (HBM) and related silicon-to-systems solutions. Work within a design engineering team to develop, validate, and optimize memory/logic/analog circuits from schematic through layout and tape-out.
Collaborate with Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to ensure manufacturability, quality, reliability, and timely product delivery.
Mid-level. Specific years of experience not stated.
Primary responsibilities include circuit design, verification, layout support, and cross-functional collaboration to deliver manufacturable memory products.
Must-have technical skills and tools for the role.
Employer will accept a Master’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related field. (No other degrees or equivalent-experience language was specified in the posting.)
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
