Electronics Package Reliability Simulation Internship (Fall 2026)

Job Title

Electronics Package Reliability Simulation Intern — Fall 2026 Strategic Student Program

Role Summary

Internship within Siemens Digital Industries Software’s Strategic Student Program supporting development and validation of multiphysics simulation workflows for advanced semiconductor packaging reliability. The role partners with application engineers, product managers, and development teams to build, test, document, and demonstrate 2.5D/3D IC package reliability workflows.

Experience Level

Entry-level internship, targeted at students currently enrolled in university programs (Master’s-level preferred per role details).

Responsibilities

Primary responsibilities focus on learning, supporting, and documenting simulation workflows and assisting with customer-facing testing and content.

• Use and learn Simcenter SimLab workflows for package reliability and multiphysics simulation.
• Support development and enhancement of 2.5D/3D IC package reliability analysis workflows.
• Test, validate, and report on workflow performance; propose improvements.
• Create end-to-end tutorials, example models, and user documentation.
• Produce technical content such as presentations, videos, and training materials.
• Assist with customer-oriented testing, issue reproduction, and feature validation.
• Support demos, technical marketing activities, and live events as needed.

Requirements

Must-have qualifications and skills for a successful candidate.

• Authorized to work in the United States without current or future sponsorship.
• Comfortable working fully remotely and able to manage time effectively.
• Basic understanding of finite element analysis (FEA), structural simulation, or multiphysics concepts.
• Familiarity with semiconductor packaging concepts (2.5D/3D IC packaging, chiplets, interposers, substrates, thermal management, warpage, reliability concepts).
• Basic Python scripting skills.
• Strong analytical, problem-solving, communication, and teamwork skills; self-motivated and proactive.
• Preferred: exposure to package reliability testing or simulation projects; familiarity with simulation/CAD tools (Simcenter products, HyperMesh, OptiStruct, Radioss, HEEDS, NX); experience with video/technical content tools (e.g., Camtasia).

Education Requirements

Posting references multiple academic expectations: currently enrolled as an undergraduate student and explicitly notes candidates pursuing a Master’s degree in Mechanical Engineering or a related technical field. Minimum 3.0 GPA is required. Fields mentioned: Mechanical Engineering and related engineering/technical disciplines. No certifications or explicit equivalent-experience language provided.

About the Company

Company: Siemens

Headquarters: Munich, Germany

Siemens EDA is a leading global provider of Electronic Design Automation (EDA) products and systems. Their innovative solutions enable companies to enhance the development of electronic products efficiently and effectively, keeping pace with the complex demands of technology and physics. Siemens is committed to delivering advanced workflow solutions that integrate both EDA and MCAD tools for multi-domain design and manufacturing in the semiconductor industry.