Job Title
Electrical Failure Analysis Engineer – NAND Technology
Role Summary
The Electrical Failure Analysis Engineer on the NAND Technology Integration (NTI) team diagnoses and verifies yield-limiting failures for next-generation NAND products. The role combines bench testing, probe data analysis, electrical characterization, and physical failure analysis to identify root causes and deliver actionable recommendations for yield improvement.
Experience Level
Mid-level. The posting requires proven semiconductor industry experience but does not specify a years-of-experience range.
Responsibilities
Primary responsibilities focus on electrical failure analysis, root cause identification, and collaboration with cross-functional teams to improve manufacturing yield.
- Lead electrical failure analysis: characterization, fault isolation, failure verification, and physical de-processing.
- Perform root cause analysis by correlating electrical, inline, parametric, probe, and fab data.
- Develop and implement new FA methodologies and de-processing techniques to improve detection accuracy and turnaround time.
- Analyze large semiconductor datasets to identify failure signatures, trends, and anomalies.
- Produce clear FA reports and visualizations for technical and executive audiences.
- Collaborate with Process Integration, Yield Enhancement, Metrology, R&D, and Data Science teams to drive yield improvements.
- Support technology transfer from R&D to manufacturing for layout and architecture fundamentals.
- Present results in global forums and communicate findings with explainability (feature importance, sensitivity analysis, trend narratives).
- Follow health, safety, and environmental standards in all FA activities.
Requirements
Core technical skills and industry experience required to perform FA for NAND devices.
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Must-have: Proven semiconductor industry experience in Failure Analysis, Process Integration, Yield Enhancement, or Unit Process.
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Must-have: In-depth knowledge of nonvolatile memory technologies (NAND/NOR) and semiconductor process flow including process–device interactions.
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Must-have: Hands-on or theoretical expertise with SEM, FIB, TEM, and elemental analysis techniques (EDS, EELS).
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Must-have: Experience with electrical characterization, bench testing, probe data analysis, and correlating multiple data sources for RCA.
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Must-have: Strong analytical skills and ability to create clear technical reports and visualizations.
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Nice-to-have: Familiarity with large-scale data analytics applied to semiconductor datasets and experience working with Data Science teams.
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Nice-to-have: Prior experience in technology transfer between R&D and manufacturing.
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Nice-to-have: Demonstrated ability to present in global technical forums.
Education Requirements
M.S. or Ph.D. in Electrical Engineering, Microelectronics, Materials Science, Chemical Engineering, Physics, or a related field.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

Date Posted: 2026-05-30