DRAM Product Engineer

Job Title

DRAM Product Engineer

Role Summary

Design, implement, and support production-ready board/PCBA test solutions for a high-volume board that integrates multiple AI accelerator chips, high-current power delivery, embedded control, and PCIe Gen6 interconnect. The role focuses on developing DRAM test methodologies, diagnostics, simulation models, and statistical analysis to improve memory reliability and manufacturing yield.

This is a hands-on individual contributor role working with board test engineering, design, architecture, and manufacturing teams to deliver robust, repeatable tests for offshore production. Some positions may require eligibility checks for export-control compliance.

Experience Level

Mid-level. The posting requires demonstrated technical experience but does not state a specific number of years.

Responsibilities

Primary responsibilities include developing and executing DRAM and board-level test strategies, diagnosing failures, and providing diagnostic feedback to improve product quality and yield.

• Develop and execute test strategies for DRAM devices and their interconnects covering functional, timing, signal integrity, and reliability failure modes.
• Diagnose complex DRAM issues across logical, architectural, and physical domains (cell behavior, addressing, timing margins, interface interactions).
• Build, modify, and maintain simulation models to study DRAM behavior and interfaces at multiple abstraction levels.
• Use simulation tools to explore corner cases, stress conditions, and failure mechanisms prior to and alongside silicon testing.
• Transform and correlate data between logical representations (addresses, transactions, algorithms) and physical implementations (cells, banks, rows/columns, wires, timing paths).
• Analyze circuit-level effects such as variability, noise, leakage, and process impacts on memory operation.
• Apply statistical methods to large test datasets to identify trends, isolate root causes, and support yield and reliability conclusions.
• Collaborate with design, architecture, and manufacturing teams to feed diagnostics into design and test improvements.
• Implement robust, repeatable tests and support offshore manufacturing test execution and silicon bring-up.

Requirements

Required technical skills and capabilities for successful performance in this role.

• Strong background in DRAM architecture, operation, and interfaces.
• Solid understanding of DRAM failure modes and associated test and characterization methods.
• Solid understanding of advanced CMOS electronic circuit behavior and its impact on memory operation.
• Experience applying statistical methods to hardware test and characterization problems.
• Strong mathematical skills for modeling, analysis, and problem solving in test development.
• Ability to reason across abstraction levels, from physical circuits to logical test algorithms.

Preferred / nice-to-have:

• Experience with memory test, silicon bring-up, and failure analysis.
• Exposure to SPICE or equivalent circuit-level simulation tools.
• Experience analyzing high-volume test data and yield trends.
• Familiarity with manufacturing or system-level memory test environments.

Education Requirements

Bachelor's or Master's degree in Electronics, Electrical Engineering, or a related field (BS or MS in Electronics and Electrical Engineering or related field). No explicit mention of equivalent-experience language was provided.

About the Company

Company: Fractile

Headquarters: London, UK

Fractile is on a mission to revolutionize AI by developing silicon, systems, and software that enable the fastest execution of advanced models at lower costs. Established in 2022, the company has rapidly expanded, fostering a collaborative culture in its London and Bristol offices. With a focus on innovation in ML/AI IC product development, Fractile combines hardware and software to deliver high-impact solutions for data center applications.