Director, Technical Package Development

Job Title

Director, Technical Package Development

Role Summary

Lead strategy, development, and execution of advanced DRAM packaging solutions across Micron’s memory portfolio. Manage technology roadmaps, advance next-generation packaging architectures, and build a global engineering organization that delivers products from concept through high-volume manufacturing.

This role combines technical leadership, business strategy, customer engagement, and digital transformation to accelerate product development and maintain competitive packaging technology.

Experience Level

Senior - 15+ years of semiconductor packaging experience, including delivery of advanced packaging technologies through high-volume manufacturing; 10+ years leading engineering teams or global technology programs.

Responsibilities

Lead technical and organizational activities to define and deliver advanced DRAM packaging capabilities.

• Define and execute long-term DRAM packaging strategy and technology roadmaps.
• Lead development and deployment of advanced packaging technologies (e.g., HBM, LPDRAM, DDR, 2.5D/3D integration, heterogeneous integration, chiplets, next‑gen interconnects).
• Drive adoption of AI/ML, advanced analytics, and digital engineering to improve product development and manufacturing productivity.
• Build, develop, and lead a global engineering organization focused on innovation, technical excellence, accountability, and execution.
• Partner cross-functionally with design, product engineering, manufacturing, quality, supply chain, and technology development to deliver products into high-volume manufacturing.
• Establish and maintain strategic relationships with customers, OSATs, foundries, suppliers, equipment vendors, and research institutions.
• Lead technology investment decisions using benchmarking, cost analysis, risk assessment, and business case development.
• Improve organizational performance through scalable engineering processes, automation, knowledge management, and data-driven decision making.

Requirements

Key qualifications and experience required and preferred for success in this role.

• Must-have: 15+ years of semiconductor packaging experience delivering advanced packaging technologies into high-volume manufacturing.
• Must-have: 10+ years of experience leading engineering teams, complex technology programs, or global engineering organizations.
• Must-have: Demonstrated technical expertise with advanced packaging platforms (HBM, LPDRAM, DDR, 3D stacking, 2.5D/3D integration, heterogeneous integration, chiplets, interconnect solutions).
• Must-have: Proven ability to drive business-critical technology decisions through technical analysis, risk assessment, and cross-functional collaboration.
• Must-have: Experience partnering with manufacturing, quality, supply chain, and external partners (OSATs, foundries, suppliers, equipment vendors).
• Must-have: Experience driving organizational effectiveness via processes, automation, knowledge management, and data-driven metrics.
• Nice-to-have: Experience implementing AI, machine learning, advanced analytics, or digital engineering solutions to improve engineering or manufacturing outcomes.
• Nice-to-have: Track record of innovation (patents, publications, conference presentations) and experience representing an organization to customers and industry forums.
• Nice-to-have: Experience leading digital transformation initiatives and interest in developing Agentic AI workflows.

Education Requirements

Bachelor’s degree required in Engineering, Materials Science, Physics, Computer Engineering, or a related technical field. Master’s degree or PhD in a related technical field is preferred. (No certifications explicitly required.)

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.