Director – Superchip SoC Technical Program Manager

Job Title

Director – Superchip SoC Technical Program Manager

Role Summary

The Superchip SoC Technical Program Manager (TPM) leads the end-to-end execution of a complex multi-die SoC program, owning schedule, tapeout readiness, cross-die integration, and executive reporting. The role coordinates Die TPMs, Functional TPMs, engineering leads, and external IP/vendor stakeholders to deliver the program on schedule, on budget, and to required quality.

Experience Level

Senior-level: requires extensive semiconductor experience (20+ years preferred) and a minimum of 5 years of Technical Program Management leading large-scale SoC programs.

Responsibilities

The TPM will control program deliverables, manage risks, and align multiple teams toward tapeout and product delivery.

• Define and own the overall SoC execution plan, master schedule, and tapeout readiness.
• Coordinate Die TPMs and Functional TPMs to align cross-die dependencies, critical path, and engineering readiness.
• Drive cross-functional integration with Chip, Die, Domain, IP, and Engineering leads.
• Manage program risk, mitigation plans, and escalate executive issues as needed.
• Lead major governance events: landmark reviews, architecture reviews, tapeout readiness reviews, and executive reviews.
• Ensure third-party IP and vendor plans align with program objectives in partnership with IP Management.
• Coordinate pre- and post-silicon validation planning, lab readiness, and resource transitions.
• Consolidate program metrics, analyze trends, and provide actionable insights to support executive decision-making.
• Supervise program resources and engineering costs to keep execution aligned with business objectives.

Requirements

Must-have technical and leadership experience necessary to run large, multi-die SoC programs.

• 20+ years of semiconductor industry experience working on SoC or related silicon programs.
• Minimum 5 years of Technical Program Management experience leading large-scale SoC programs.
• Proven track record delivering datacenter-class SoCs through to tapeout.
• Deep understanding of the full SoC development lifecycle from architecture through tapeout.
• Ability to lead large, multi-functional engineering organizations and influence without direct authority.
• Technical expertise in one or more silicon build functional areas (front-end, verification, physical build, power & performance, etc.).
• Nice-to-have: multi-die/chiplet experience, hyperscaler or AI/datacenter silicon background, experience managing multiple Die and Functional TPMs, strong executive communication skills.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.

About the Company

Company: Arm

Headquarters: Cambridge, United Kingdom

ARM is a global leader in semiconductor and software design, driving innovation in computing technology. The company specializes in designing processors and systems that provide the essential building blocks for electronic devices. ARM's architecture is widely used in smartphones, servers, and IoT devices, and its collaborative culture fosters bold thinking, diversity, and high-impact benefits for its talented workforce.