Director, Semiconductor IC Packaging & Assembly Engineering

Job Title

Director, Semiconductor IC Packaging & Assembly Engineering

Role Summary

Lead assembly sustaining engineering and high-volume manufacturing for advanced semiconductor packaging technologies, with focus on power and wide-bandgap products. Responsible for yield, process stability, quality, change management, manufacturing readiness, and cross-functional coordination with Package Engineering, R&D, Quality, Supply Chain, and OSAT partners to transition NPI into scalable high-volume manufacturing.

Manage a global engineering organization to drive manufacturing excellence, cost competitiveness, and reliable production for AI/data-center and power-packaging applications.

Experience Level

Senior-level. Typical background: 12+ years in semiconductor manufacturing and packaging engineering, including 5+ years of engineering leadership experience.

Responsibilities

Accountable for assembly operations performance, yield improvement, quality, process control, and partner management.

• Lead sustaining engineering across assembly technologies and product lines to meet yield, cycle time, throughput, quality, and cost targets.
• Own yield monitoring, trend analysis, SPC/DOE-based problem solving, and corrective action processes.
• Define KPIs and dashboards to measure manufacturing performance and engineering effectiveness.
• Maintain process controls, qualification plans, and reliability standards across OSAT and manufacturing sites.
• Manage process change control for materials, equipment, tooling, flows, and site transfers; lead qualification and readiness activities.
• Serve as the manufacturing engineering interface for NPI-to-production transfers and structured ramp execution.
• Manage global OSAT/contract-manufacturer relationships, audits, benchmarking, and capacity planning.
• Build and develop a high-performing, distributed assembly engineering team, including talent development and succession planning.

Requirements

Must-have technical experience and leadership qualifications (degrees summarized under Education Requirements).

• 12+ years of semiconductor manufacturing and packaging engineering experience with significant exposure to IC assembly operations, package development, qualification, and NPI-to-HVM transfers.
• 5+ years of leadership experience managing engineering teams in semiconductor manufacturing environments.
• Deep expertise in assembly processes (wirebond, flip-chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT) and power packaging; familiarity with DBC, AMB, SiC/GaN is highly valued.
• Strong skills in yield analysis, SPC, DOE, statistical analysis tools, reliability testing, and process control methodologies.
• Experience managing global OSATs and outsourced manufacturing ecosystems, including partner selection, qualification, and ongoing technical oversight.
• Proven track record of successful NPI-to-HVM ramp execution and manufacturing readiness.
• Experience with quality systems, change management, supplier audits, and corrective/preventive action programs.
• Excellent analytical, organizational, communication, and cross-functional leadership abilities.

Education Requirements

Required: Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related technical discipline. Preferred: Master’s degree or PhD in Engineering or related field. (Education and degree preferences extracted from Qualifications and Preferred Qualifications.)

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.